Development and manufacturing of laser systems for micromachining as well as laser contract manufacturing
3D-Micromac AG
09126 Chemnitz (Technologie-Campus 8)New on Amplifa
About 3D-Micromac
3D-Micromac AG was founded in 2002 in Chemnitz and today employs more than 190 staff. The company develops processes, machines and turnkey solutions for laser micromachining, in particular with ultrashort-pulse lasers (femtosecond/picosecond), nanosecond lasers and excimer lasers; more than 100 excimer laser systems built by 3D-Micromac are in industrial use. The portfolio includes wafer dicing with TLS-Dicing (Thermal Laser Separation), laser annealing for ohmic contact formation on SiC wafers, selective laser annealing for GMR/TMR magnetic field sensors, laser trimming and link cutting, laser-based sample preparation for SEM and TEM analysis, micro drilling and laser marking. Materials processed include semiconductor wafers such as silicon and silicon carbide (SiC) as well as glass and metals. In addition to the systems business, the company offers process and technology development in its application laboratory from feasibility to small series, as well as laser contract manufacturing for small and large series. Target industries are the semiconductor industry, photovoltaics, glass and display technology, micro diagnostics, electronics manufacturing, medical technology and ophthalmic optics. The site is Technologie-Campus 8 in Chemnitz.
- Site
- Chemnitz
- Processes
- Laser micromachining with ultrashort-pulse lasers (fs/ps) and, Excimer laser micromachining, Wafer dicing using TLS-Dicing (Thermal Laser Separation), Laser annealing for ohmic contact formation (OCF) on SiC wafer backsides, Selective laser annealing for monolithic magnetic sensors (GMR/TMR), Laser trimming / link cutting on semiconductor chips (programming of digital logic circuits,, Laser-based sample preparation for SEM, TEM and micromechanics (cross-sections, TEM lift-out,, Laser micro drilling (e.g. nozzle manufacturing using excimer lasers)
- Materials
- Silicon carbide (SiC), Silicon (semiconductor wafers), Glass, Ultrashort-pulse lasers (fs/ps), Excimer lasers, TLS-Dicing (Thermal Laser Separation)
- Certificates
- DIN EN ISO 9001:2015, ISO 9001:2015
- Founded
- 2002
- Employees
- 190+
- Industries
- Semiconductor industry, Photovoltaics, Glass and display technology, Micro diagnostics and failure analysis, Electronics manufacturing, Medical technology
- 01
Process and technology development in the application laboratory
- 02
Prototype and small-series production
- 03
Laser contract manufacturing
- 04
System construction and turnkey delivery
- 05
Commissioning and customer training
- 06
Maintenance, service-level agreements and spare parts management
Materials & Laser Processes
Ultrashort-pulse lasers (fs/ps)
Precise micromachining of semiconductor wafers, glass and metals with minimal heat input.
Excimer lasers
Industrial microprocessing, e.g. nozzle drilling and marking of ophthalmic lenses.
TLS-Dicing (Thermal Laser Separation)
Chipping-free wafer dicing of silicon and SiC wafers with increased yield.
Silicon (semiconductor wafers)
Substrate for dicing, laser trimming and laser contact opening in photovoltaics.
Silicon carbide (SiC)
Substrate for wafer dicing and laser annealing for ohmic contact formation in power semiconductors.
Glass
Machining for glass and display technology applications.
Sites
Chemnitz
DEHeadquarters, development, manufacturing and application laboratory
- Lot size
- Small series to large series (contract manufacturing)
- Materials
- Semiconductor wafers (Si, SiC), glass, metals
- microPREP PRO FEMTO (femtosecond laser system)
- microPREP L
- microDICE (TLS-Dicing)
- microPRO XS OCF
- microVEGA xMR
- microVEGA FC
- microCELL TLS
- microCELL OTF
- microFLEX
Systems & Components
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Laser micromachining with ultrashort-pulse lasers (fs/ps) andMachining | – | – | – | – | Semiconductor wafers, Glass, Metals |
| Excimer laser micromachiningMachining | – | – | – | – | – |
| Wafer dicing using TLS-Dicing (Thermal Laser Separation)Machining | – | – | – | – | Silicon carbide (SiC), Semiconductor wafers |
| Laser annealing for ohmic contact formation (OCF) on SiC wafer backsidesHeat treatment | – | – | – | – | Silicon carbide (SiC), metallized wafer backsides |
| Selective laser annealing for monolithic magnetic sensors (GMR/TMR)Heat treatment | – | – | – | – | – |
| Laser trimming / link cutting on semiconductor chips (programming of digital logic circuits,Machining | – | – | – | – | – |
| Laser-based sample preparation for SEM, TEM and micromechanics (cross-sections, TEM lift-out,Testing | – | – | – | – | – |
| Laser micro drilling (e.g. nozzle manufacturing using excimer lasers)Machining | – | – | – | – | – |
| Laser marking (e.g. marking of ophthalmic lenses)Surface | – | – | – | – | – |
| Laser contract manufacturing of components for small and large seriesMachining | – | – | – | Small series – Large series | – |
| Application and process development (feasibility, prototypes, functional prototypes, small series)Engineering | – | – | – | – | – |
| Laser contact opening for photovoltaic production systemsSurface | – | – | – | – | Silicon (solar cells) |
9 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Laser micromachining system for sample preparation (femtosecond laser) | 3D-Micromac microPREP PRO FEMTO | – | – | – | Chemnitz |
| Laser sample preparation system for whole-wafer and system-level failure analysis | 3D-Micromac microPREP L | – | – | – | – |
| Wafer dicing system with TLS-Dicing (Thermal Laser Separation) | 3D-Micromac microDICE | – | – | – | – |
| Laser annealing system for OCF (UV-DPSS laser, ns pulses, spot scanning) | 3D-Micromac microPRO XS OCF | – | – | – | – |
| Selective laser annealing system for magnetic sensors (GMR/TMR) | 3D-Micromac microVEGA xMR | – | – | – | – |
| Laser microprocessing system (high throughput, trimming/link cutting) | 3D-Micromac microVEGA FC | – | – | – | – |
| Laser system for photovoltaics (laser contact opening) | 3D-Micromac microCELL TLS | – | – | – | – |
| Laser system for photovoltaics (on-the-fly) | 3D-Micromac microCELL OTF | – | – | – | – |
| Laser system for flexible electronics / roll-to-roll | 3D-Micromac microFLEX | – | – | – | – |
Additional services
Quality
Since 2003 the company has been certified to DIN EN ISO 9001:2015 (TÜV SÜD, certificate no. 12 100 44518 TMS), covering development, production, sales and service of the laser systems. Since 2019, 3D-Micromac has been a member of the German Association for Quality (DGQ).
| Evidence | Chemnitz |
|---|---|
| ISO 9001:2015 |
History
- 2002
Foundation of 3D-Micromac AG in Chemnitz with six employees
- 2003
Market launch of the world's first commercial ultrashort-pulse laser system
- 2004
Development of an industrial-grade excimer laser system for marking eyeglass lenses
- 2007
Winner of the Saxon Innovation Award
- 2009
Opening of the company headquarters at Technologie-Campus Chemnitz
- 2010
Market launch of production systems for nozzle manufacturing using excimer lasers
- 2011
Winner of the SPIE Green Photonics Award and Taiwan Laser Application Excellence Award
- 2013
Strategic realignment towards industrial growth markets
- 2014
Foundation of 3D-Micromac America, LLC; acquisition of Thermal Laser Separation technology (TLS-Dicing®); market launch of production systems for laser contact opening
- 2015
Solar Industry Award in the 'PV Tool' category
- 2017
New company headquarters
- 2018
Winner of the TÜV SÜD Innovation Award
- 2022
microVEGA® XMR laser annealing system awarded the Laser Focus World Innovators Award
- 2024
microPREP® PRO FEMTO awarded the Laser Focus World Innovators Award