Develops and manufactures industrial laser systems for glass processing, surface treatment and tire production.
4JET GmbH
Alsdorf · Krailling · Shanghai · AtlantaNew on Amplifa
Laser systems for glass, surfaces and tires
4JET GmbH, headquartered in Alsdorf, is a manufacturer of industrial laser systems for precise cleaning, cutting, drilling and structuring of sensitive technical surfaces. The company combines laser process technology with optics, image processing, automation and its own Core4 software platform into turnkey production solutions. Core applications are laser-based glass processing (Bessel beam cutting, nanoPerforation, glass drilling/TGV, wafer dicing), thin-film processing, laser cleaning and laser interference structuring (DLIP) as well as laser systems for tire manufacturing. Materials processed include glass, borosilicate glass, fused silica, glass-ceramic, semiconductor materials such as silicon, SiC, GaAs and InP, coatings and rubber. Customers come from industries such as the tire and automotive industry, architectural glass, thin-film PV, semiconductors, displays, augmented reality, optics, medical, life sciences and aerospace. The headquarters at the Alsdorf site (campus opened 2024, approx. 27,000 m²) comprises R&D, an applications lab and assembly; further sites exist in Krailling, Shanghai and Atlanta.
- Site
- Alsdorf
- Processes
- Laser cutting of glass (free-form cutting, Bessel beam / nanoPerforation, EnP), Laser cutting of glass and brittle materials (Bessel beam, stress-free edges), Laser cleaning (non-contact, hand-held or integrated), Tire mold cleaning, Tire innerliner cleaning, Selective laser ablation of rubber on tire beads (laser uniformity correction), LEAF – Shark Skin: large-area production of flow-optimized surfaces by means of, Surface functionalization by laser interference structuring (DLIP)
- Materials
- Glass (general, incl. thin glass, glass wafers, glass substrates), Borosilicate glass, Fused silica, BK7, Glass-ceramic, Tempered and untempered glass, Specialty glass, Silicon
- Certificates
- EN ISO 9001:2025, EN ISO 14001:2025, ISO 9001, ISO 14001
- Founded
- 2006
- Employees
- approx. 180 at the
- Industries
- Tires, Architectural glass and household appliances, Augmented reality, Automotive industry, Aerospace, Displays
- 01
Research & development (laser processes, optics, software)
- 02
Applications lab and process development
- 03
Engineering and system integration (automation, Core4 software)
- 04
Assembly of laser systems in Alsdorf
- 05
Commissioning and line integration at the customer
- 06
Technical service, maintenance and after-sales worldwide
Materials and processes
Glass (incl. borosilicate glass, fused silica, BK7, glass-ceramic, tempered
Core material for laser cutting, glass drilling, TGV and wafer dicing in optics, semiconductors and architectural glass.
Silicon (wafers)
Processing in wafer dicing and MEMS/photonics structuring.
Silicon carbide
Laser cutting and structuring of brittle compound semiconductor substrates.
Gallium arsenide
Laser processing of compound semiconductor wafers.
Indium phosphide
Laser processing of compound semiconductor wafers.
Sapphire
Brittle substrate for laser-based cutting and dicing.
Conductive layers (ITO, FTO, Low-E)
Selective laser coating removal with minimal heat input.
Thin-film PV materials (perovskite, CIGS, CdTe)
P1/P2/P3 laser scribing of thin-film solar cells.
Rubber (tires)
Laser marking, innerliner and mold cleaning as well as uniformity correction.
Sites
Alsdorf
DEHeadquarters, R&D, applications lab, assembly
- Materials
- Glass, semiconductor materials, rubber
- PEARL 400S
- PEARL 500X
- PEARL 900S
- PEARL 80G
- TOPAZ LD
- TOPAZ 3D
- TOPAZ Px
- DTX 200 NX
- LASER-FIT Line
- LUC
- T-Mark
- STMCS
- TCS
- JETLASER
Krailling
DECompetence center for micromachining (formerly Corning Laser Technologies, acquired 2025)
- Materials
- Glass, wafers
Shanghai
CNSales and service center for Asia
Atlanta
USDemonstration center for tire machinery and US service center
Solutions and systems
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Laser cutting of glass (free-form cutting, Bessel beam / nanoPerforation, EnP)Machining | – | – | – | – | Glass, Borosilicate glass, Fused silica, BK7, Glass-ceramic, Tempered glass, Coated glass |
| Laser cutting of glass and brittle materials (Bessel beam, stress-free edges)Machining | – | – | – | – | Glass, SiC, Silicon, Sapphire |
| Laser cleaning (non-contact, hand-held or integrated)Surface | – | – | – | – | Wide range of surfaces |
| Tire mold cleaningSurface | – | – | – | – | Steel (tire molds) |
| Tire innerliner cleaningSurface | – | – | – | – | Rubber |
| Selective laser ablation of rubber on tire beads (laser uniformity correction)Surface | – | – | – | – | Rubber |
| LEAF – Shark Skin: large-area production of flow-optimized surfaces by means ofSurface | – | – | – | – | Organic coatings, aerospace surfaces |
| Surface functionalization by laser interference structuring (DLIP)Surface | – | – | – | – | Glass, Coatings |
| Glass drilling (non-contact, without tool change/water)Machining | – | – | – | – | Glass, Fused silica, Sapphire, Glass wafers |
| Tire lettering / high-contrast marking ("Suberblack" markings)Surface | – | – | – | – | Rubber, Tire sidewalls |
| Wafer dicing (laser perforation + scribe-&-break, dies from 1 mm²)Machining | – | – | – | – | Glass wafers, Borosilicate, Fused silica, ultra-thin wafers < 50 µm, Silicon, SiC, GaAs, InP, Sapphire |
| Thin-film processing: selective removal of conductive layersSurface | – | – | – | – | TCO (ITO, FTO), Low-E coating, AR/dielectric/metallic coatings, Perovskite, CIGS, CdTe |
| P1/P2/P3 laser scribing of thin-film PV cells (perovskite, CIGS, CdTe, tandem)Surface | Scribe alignment below 10 µm | – | – | – | Perovskite, CIGS, CdTe, Tandem cells |
| TGV drilling (through glass vias, high aspect ratio)Machining | – | – | – | – | Glass interposers |
| Wafer structuring for MEMS and photonics (USP lasers, 2.5D/3D topographies)Machining | – | – | – | – | Glass, Silicon, GaAs, InP, SiC, Sapphire |
| Cutting and structuring of compound semiconductor materials (GaAs, InP, SiC)Machining | – | – | – | – | GaAs, InP, SiC |
| Precision drilling of gas distribution plates (showerhead plates)Machining | – | – | – | – | Glass |
| Silent tires: directly foamed noise-damping tire innerlinersSurface | – | – | – | – | Rubber |
| Laser pre-treatment / surface preparation of sensitive technical surfacesSurface | – | – | – | – | Sensitive technical surfaces |
| Laser paint removal / delaminationSurface | – | – | – | – | Coatings |
| Edge processing and notch fabrication on wafers / edge passivationMachining | – | – | – | – | Wafers, Glass |
| Laser cutting and shaping of optical glass, crystals and wafers; aperture processing;Machining | Sub-micrometer precision | – | – | – | Fused silica, BK7, Borosilicate glass, Specialty glass, Crystals, Wafers |
| Automated laser technology / system integration: handling, cassette and box loading, SCARA andAssembly | – | – | – | – | – |
| Engineering / system development for laser processes, automation, software and system integrationEngineering | – | – | – | – | – |
| Automated quality inspection / machine vision systems (light-sheet scanning,Testing | – | – | – | – | – |
17 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Laser processing platform for glass wafers and glass substrates | 4JET PEARL 400S | – | – | – | Alsdorf, Germany |
| All-in-one laser machine for glass processing (up to 4 process heads) | 4JET PEARL 500X | – | – | – | Alsdorf, Germany |
| Laser system for large-format glass substrates | 4JET PEARL 80G | – | Max. working area single-sheet: 2350 mm × 3700 mm; dual-sheet: 2350 mm × 1900 mm | – | Alsdorf, Germany |
| Laser delamination system | 4JET TOPAZ LD | – | Processing in 80 mm wide increments across the entire glass width; system dimensions approx. 6200 mm | – | Alsdorf, Germany |
| Laser system for thin-film processing | 4JET TOPAZ 3D | – | – | – | – |
| Laser system for thin-film processing (P1-P3 scribing) | 4JET TOPAZ Px | – | – | – | – |
| Wafer dicing system | 4JET DTX 200 NX | – | – | – | – |
| Laser system for tire processing | 4JET LASER-FIT Line | – | – | – | – |
| Laser uniformity correction system for tires | 4JET LUC | – | – | – | – |
| Tire marking system | 4JET T-Mark | – | – | – | – |
| Tire marking system (compact) | 4JET T-Mark Compact | – | – | – | – |
| Tire processing system | 4JET TCS | – | – | – | – |
| Tire processing system | 4JET STMCS | – | – | – | – |
| Laser cleaning system (hand-held/integrated) | 4JET JETLASER | – | – | – | – |
| Laser cleaning system (integrated variant) | 4JET JETLASER Integration | – | – | – | – |
| Laser system for glass drilling | 4JET PEARL 900S | – | – | – | – |
| Prototype laser system for flow-optimized surfaces (shark skin) | 4JET LEAF (Laser Enhanced Air Flow) | – | – | – | – |
Additional services
Reference customers
Quality
Quality and environmental management systems are certified according to DIN EN ISO 9001 and DIN EN ISO 14001. The R&D activities have been awarded the BSFZ seal several times; the laboratories feature modern metrology such as scanning electron and laser scanning microscopy as well as large-area coordinate measuring technology.
| Evidence | Alsdorf | Krailling | Shanghai | Atlanta |
|---|---|---|---|---|
| ISO 9001 | ||||
| ISO 14001 |
History
- 2006
Founded in Hückelhoven; entry into the tire market
- 2008
Entry into the photovoltaics market; VC investment eCapital
- 2009
Relocation to Alsdorf
- 2013
Foundation of 4JET Americas Inc
- 2014
Entry into the glass market
- 2016
Entry into aerospace
- 2018
Investment round Jolt Capital
- 2019
Foundation of 4JET China
- 2020
Acquisition of the tire inspection business unit from Hennecke Systems; MicroFab job shop in Alsdorf
- 2021
Opening of the Atlanta service and demo center; launch of JETLASER M100
- 2022
Opening of the production plant in Aachen; launch of TOPAZ PV scribing
- 2023
Launch of LUC (uniformity correction), PEARL VLIS/TGV with Plan Optik, LEAF cooperation with Nikon
- 2024
Move to new headquarters in Alsdorf-Hoengen (27,000 m²); launch of LASER-FIT Line; award Tire Supplier of the Year
- 2025
Acquisition of Corning Laser Technologies GmbH; new site in Krailling
- Transformati
Merger of the four operating companies into 4JET GmbH