EMS provider for development, SMD and THT assembly, testing and device assembly of electronic assemblies in Meiningen.
ABS electronic Meiningen GmbH
Meiningen (company headquarters, production)New on Amplifa
About ABS electronic
ABS electronic Meiningen GmbH was founded on 1 June 1998 and is a mid-sized provider of Electronic Manufacturing Services (EMS) headquartered in Meiningen, Thuringia. The company offers the complete spectrum of services, from project planning and consulting through layout creation, PCB design and PCB routing to electronic manufacturing of populated printed circuit boards in SMD and THT technology. High-performance placement machines process the entire component spectrum from 0201 to QFP, BGA, μBGA, CBG, CSP and Flip-Chip; special technologies such as Package on Package (PoP) are realized in small and medium series. The manufacturing portfolio includes reflow, vapor phase, wave, selective and hot bar soldering as well as complete assembly and device assembly including final inspection. The offering is rounded off by material management with a worldwide component procurement network, assembly testing, delivery on demand and after-sales service. ABS electronic supplies customers from the automation, assembly and control technology sectors.
- Site
- Meiningen
- Processes
- SMD assembly (electronic manufacturing), Package on Package (PoP), Reflow soldering, Vapor phase soldering, Wave soldering (dual wave), Selective soldering, Hot bar soldering, Manual THT assembly / hand soldering
- Materials
- Printed circuit boards (populated), Electronic components (SMD/THT), SMD assembly, THT assembly, Package on Package, NPI / DFx analyses
- Certificates
- Quality management system (specific standard, e.g. ISO 9001, not specified), Creditworthiness certificate, Participation in the Network for Sustainable Business (extended until 2025), ISO 9001, Creditreform creditworthiness certificate, Network for Sustainable Business (until 2025)
- Founded
- 1998-06-01
- Industries
- Electronics industry, Automation technology, Control and assembly technology, Electronic Manufacturing Services (EMS) for the electronics industry
- 01
Project planning and consulting
- 02
Layout creation, PCB design and PCB routing
- 03
Material management and worldwide component procurement
- 04
Stencil printing with optical paste inspection
- 05
SMD assembly (0201 to Flip-Chip, PoP)
- 06
Soldering: reflow, vapor phase, wave, selective, hot bar soldering, hand
- 07
THT assembly (manual)
- 08
Assembly testing (AOI, Flying Probe, Boundary Scan, functional test)
- 09
Assembly mounting, mechanical device construction, final inspection
- 10
Delivery on demand and after-sales service
Processes and Technologies
SMD assembly
Processing of the entire component spectrum from 0201 to QFP, BGA, μBGA, CBG, CSP and Flip-Chip in small and medium series.
THT assembly
Conventional and mixed assembly with manual THT assembly, wave, selective, hot bar and hand soldering.
Package on Package
Special technology for stacked components in small and medium series.
Printed circuit boards (populated)
Manufacturing and assembly of printed circuit boards to customer specifications, incl. impedance control and serial numbering.
NPI / DFx analyses
Design-for-Excellence measures across the entire product life cycle for cost- and product-optimized layout design.
Location
Meiningen
DECompany headquarters and production
- Lot size
- Small series to medium series
- Materials
- SMD components (0201, QFP, BGA, μBGA, CBG, CSP, Flip-Chip), THT components
- High-performance placement machines (pick-and-place)
- Reflow soldering machine
- Automatic stencil printers with optical paste inspection
- Vapor phase soldering system
- Wave soldering system (lead-free, dual wave)
- Selective soldering machine
- AOI system OptiCon
- Agilent test and functional test systems
- Flying Probe system
- Hänel Lean-Lift
- Presses, riveting tools, screwdrivers for device assembly
Assemblies and Components
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD assembly (electronic manufacturing)Assembly | – | – | – | Small series – Medium series | SMD components 0201, QFP, BGA, μBGA, CBG, CSP, Flip-Chip |
| Package on Package (PoP)Assembly | – | – | – | Small series – Medium series | PoP components |
| Reflow solderingJoining | – | – | – | – | – |
| Vapor phase solderingJoining | – | – | – | – | – |
| Wave soldering (dual wave)Joining | – | – | – | – | – |
| Selective solderingJoining | – | – | – | – | – |
| Hot bar solderingJoining | – | – | – | – | – |
| Manual THT assembly / hand solderingAssembly | – | – | – | – | – |
| Stencil printing (automatic, with optical paste inspection)Assembly | – | – | – | – | – |
| Layout creation / PCB design / PCB routingEngineering | – | – | – | – | – |
| Development of complete assemblies/devices incl. EMC testing, NPI / DFx analyses, test programEngineering | – | – | – | – | – |
| Assembly mounting / mechanical device construction / final inspectionAssembly | – | – | – | – | – |
| Assembly testing: AOI, functional test, Flying Probe, Boundary ScanTesting | – | – | – | 100% visual inspection | – |
| Material management / component procurement / warehousingEngineering | – | – | – | – | – |
11 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| High-performance placement machines (pick-and-place) | – | – | Component spectrum from 0201 to QFP, BGA, μBGA, CBG, CSP, Flip-Chip | – | Meiningen |
| Reflow soldering machine | – | – | – | – | Meiningen |
| Automatic stencil printers with optical paste inspection | – | – | – | – | Meiningen |
| Vapor phase soldering system | – | – | – | – | Meiningen |
| Wave soldering system (lead-free, dual wave) | – | – | – | – | Meiningen |
| Selective soldering machine | – | – | – | – | Meiningen |
| AOI system (OptiCon inspection) | OptiCon | – | – | – | Meiningen |
| Test machines / computer-controlled functional testers | Agilent | – | – | – | Meiningen |
| Flying Probe system | – | – | – | – | Meiningen |
| Hänel Lean-Lift (storage system) | Hänel | – | – | – | Meiningen |
| Presses / riveting tools / screwdrivers (device assembly) | – | – | – | – | Meiningen |
Additional services
Reference customers
Quality and Certificates
Populated printed circuit boards are tested in a multi-stage inspection system with 100 percent visual inspection, AOI systems (OptiCon), Agilent test machines, computer-controlled functional testers, Flying Probe system and Boundary Scan. ESD guidelines are consistently implemented in all production areas.
| Evidence | Meiningen |
|---|---|
| ISO 9001 | |
| Creditreform creditworthiness certificate | |
| Network for Sustainable Business (until 2025) |
Company History
- 1998
Foundation of ABS electronic Meiningen GmbH on 1 June 1998.
- 2018
Participation in the Thuringia Sustainability Agreement (NAT).
- 2021
Founding member of, or participation in, the Energy Efficiency and Climate Protection Networks initiative (IEEKN) since July 2021.
- 2022
Article on sustainability in the Wirtschaftsspiegel Thüringen; apprentice Maurice Siede awarded IHK Education Fox 2022.
- 2023
Fabian Oertel takes over the management from Andreas Oertel on 1 July 2023; 25th company anniversary.
- 2024
Article about ABS electronic as an innovative EMS provider in the Wirtschaftsspiegel Thüringen.
- 2025
15th participation in the Thuringia's South corporate run with 20 participants; ISO 9001 certificate issued for 2025–2028.