High-precision assembly and interconnection technology for photonic and semiconductor components – from prototyping to series production.
Aifotec AG
Herpfer Str. 40, D-98617 MeiningenNew on Amplifa
About Aifotec AG
Aifotec AG is an internationally active company for high-precision assembly development and manufacturing services for the photonics industry, headquartered in Meiningen in the Thuringian Forest. Founded in 2004 by Dr. Gunther Vollrath, the company develops and manufactures photonic components and assemblies as a contract manufacturer – from process development and prototyping through to series production, also as a 2nd source. Core processes are eutectic bonding (soldering), epoxy bonding with UV- or thermally curing systems, and the coupling of optical fibers and fiber arrays (fibre coupling); flip chip bonders as well as laser- and hot-plate-based bonding systems are used. Production is carried out on leading process materials such as glass, ceramics, polymer, lead frame, PCB and silicon, with an assembly precision of ± 0.5 µm. Production takes place in an ISO Class 7 cleanroom. Customers come from the automotive sector (autonomous driving/LIDAR), medical technology, data centers, telecommunications, Industry 4.0 and the electronics industry, including the world's largest chip manufacturers.
- Site
- Meiningen
- Processes
- Photonic integration and assembly, Flip chip bonding, Eutectic bonding / soldering, Epoxy bonding, Fibre coupling (optical fiber coupling), Manufacturing / contract manufacturing, Sensor-based measuring, High-precision assembly and interconnection technology
- Materials
- Glass, Ceramics, Polymer, Lead Frame, PCB, Silicon, Eutectic Bonding (bonding/soldering), Epoxy Bonding
- Certificates
- ISO 9001
- Founded
- 2004
- Industries
- Automotive (autonomous driving/LIDAR), Medical technology (sensor-based measuring systems), Data centers, Telecommunications, Industry 4.0, Electronics industry
- 01
Process development / consulting (DfM)
- 02
Engineering / prototyping
- 03
Eutectic bonding / epoxy bonding / fibre coupling
- 04
Assembly and photonic integration
- 05
Series production / 2nd source
Materials & Processes
Eutectic Bonding (bonding/soldering)
Laser- and hot-plate-based systems assemble components from 100 micrometers to several centimeters with an accuracy of better than 1 micrometer.
Epoxy Bonding
UV- as well as thermally curing epoxy systems with active or passive alignment, precision ± 0.5 µm.
Fibre Coupling (optical fiber coupling)
Various systems for coupling optical fibers and fiber arrays with active or passive alignment; Aifotec holds PCT patents in this field.
Glass
Supported process material for photonic assembly and interconnection technology.
Ceramics
Supported process material for bonding and packaging.
Polymer
Supported process material for bonding and packaging.
Lead Frame
Supported process material for bonding and packaging.
PCB
Supported process material for bonding and packaging.
Silicon
Supported process material for semiconductor and photonic components.
Meiningen Site
Meiningen
DEProduction and headquarters
- Lot size
- From prototype to volume production
- Materials
- Glass, ceramics, polymer, lead frame, PCB, silicon
- Flip chip bonder
- Laser- and hot-plate-based bonding systems
- UV systems
- Thermally curing epoxy system
- Bonder systems
- ISO Class 7 cleanroom
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Photonic integration and assemblyAssembly | ± 0.5 μm | – | – | – | Glass, Ceramics, Polymer, Lead Frame, PCB, Silicon |
| Flip chip bondingJoining | ± 0.5 μm | – | – | – | Semiconductor components, Photonic components |
| Eutectic bonding / solderingJoining | better than 1 micrometer | – | – | – | Components |
| Epoxy bondingJoining | ± 0.5 μm | – | – | – | Components |
| Fibre coupling (optical fiber coupling)Joining | – | – | – | – | Optical fibers, Fiber arrays |
| Manufacturing / contract manufacturingAssembly | – | – | – | low – medium volume up to | various process materials |
| Sensor-based measuringTesting | – | – | – | – | various process materials |
5 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Flip chip bonder | – | – | – | – | Thuringian Forest |
| Laser- and hot-plate-based bonding systems | – | – | – | – | – |
| UV systems | – | – | – | – | – |
| Thermally curing epoxy system | – | – | – | – | – |
| Bonder systems | – | – | – | – | – |
Additional services
Reference customers
Quality
Aifotec AG is ISO 9001 certified and manufactures in an ISO Class 7 cleanroom in Meiningen. Assembly is performed with a precision of ± 0.5 µm at a yield of better than 99 %.
| Evidence | Meiningen |
|---|---|
| ISO 9001 |
Company History
- 2002
Relocation from Munich to Meiningen.
- 2004
Dr. Gunther Vollrath spins off Aifotec from the former Finsar Inc/Aifotec as part of an MBO and founds Aifotec as a contract manufacturer for high-end photonics applications.
- 2005
Completion of the ISO Class 7 cleanroom. First customers were supplied.
- 2010
Capital increase with Starbitrage AG joining as an investor.
- 2011
Aifotec produced its first million optical assemblies.
- 2012
Merger of Aifotec and Stabitrage and formation of today's Aifotec AG. Kurt Ochner joins as CFO.
- 2017
GUB Investment Trust acquires a majority stake in Aifotec.