Machines, photo-coated base material and consumables for PCB prototypes and small-series production
Bungard Elektronik GmbH & Co. KG
WindeckNew on Amplifa
About us
Bungard Elektronik GmbH & Co.KG was founded in 1961 by Heinz Bungard and is a full-line supplier for the production of prototype PCBs and small series in industrial quality. Since 1961 the company has manufactured photo-coated base material (FR4, FR2, FR3, CEM1, Teflon, Kapton, Cotherm metal core, anodized aluminum ALUCOREX) and develops matching CNC milling-drilling plotters (CCD series), etching machines (Sprint, DL 500, Titan 3500), exposure units (Hellas LED, Eurolux LED, LaserPro 3000), through-hole plating systems, multilayer presses as well as SMT equipment and software (ISOCAM, RoutePro, Filmstar). PCBs are produced from raw material to plated-through multilayer boards with solder resist mask, including surface finishing (electroless and electrolytic nickel-gold, chemical tin plating) and wastewater treatment. Typical users are electronics laboratories, model makers, pad printers and the PCB industry. The company is based in Windeck (Rhein-Sieg district) and is represented in 65 countries.
- Site
- Windeck
- Processes
- Isolation milling (CNC milling-drilling plotter), Etching (spray etching, horizontal through-feed etching, vertical etching), Exposure (vacuum exposure, contact exposure, UV laser direct imaging), Drilling (PCB drilling), Brushing/cleaning (wet brushing), Electrolytic through-hole plating (electroless-electrolytic), Mechanical through-hole plating with hollow rivets, Multilayer pressing (vacuum laminating)
- Materials
- FR4 (glass fabric, epoxy resin), FR2 (phenolic resin hard paper), FR3 (epoxy resin hard paper), CEM1 (epoxy resin composite, paper core), Teflon, Kapton film, Copper (copper cladding, e.g. 35 µm), Anodized aluminum (Alucorex, photo-coated)
- Certificates
- QualityScan 3000
- Founded
- 1961
- Employees
- 72
- Industries
- Electronics industry, Electronics laboratories, PCB industry, Model making, Pad printing, Education and research
- 01
Base material production (photo-coated)
- 02
Exposure (vacuum / contact / UV laser direct imaging)
- 03
Developing and etching (spray etching)
- 04
Drilling/milling (CNC milling-drilling plotter)
- 05
Through-hole plating (mechanical hollow rivets or electroless-electrolytic)
- 06
Surface finishing (Ni-Au, tin plating)
- 07
Multilayer pressing
- 08
SMT assembly and reflow soldering
- 09
Wastewater treatment
- 10
Quality inspection
Base material and processes
FR4 (glass fabric, epoxy resin)
The world-standard PCB base material, covering around 99% of market demand, also thin with 0.125 mm carrier thickness and 35 µm copper.
FR2 (phenolic resin hard paper)
Carrier material for simple applications.
FR3 (epoxy resin hard paper)
Carrier material for simple applications.
CEM1 (epoxy resin composite with paper core)
Composite material, easy to drill but prone to moisture absorption.
Teflon
High-quality base material for demanding RF applications.
Kapton film
Film material, photo-coated for flexible applications.
Copper
Copper cladding of the base materials, e.g. 35 µm, basis for traces and through-hole plating.
Anodized aluminum (ALUCOREX)
Photo-coated anodized aluminum in distribution since 1981.
Metal core PCB Cotherm
Metal core PCBs with and without photoresist layer.
Electroless nickel-gold (Ni/P & Au)
Versatile surface finish for PCBs.
Chemical tin plating (ORMECON, SUR-TIN)
Process for chemical tin plating of copper surfaces.
Locations
Windeck
DEHeadquarters, development and production
- Materials
- FR4, FR2, FR3, CEM1, Teflon, Kapton, copper, aluminum
- CNC milling-drilling plotter CCD series
- Spray etching systems Sprint 3000/4500/6000, DL 500, Titan 3500
- Vacuum exposure units Hellas LED, Eurolux LED, LaserPro 3000
- Through-hole plating systems Compacta 30/40, HitecPlate 3040, Protec
- Multilayer presses RMP 210/3545
- Wet brushing machines RBM 300/402
- SMT systems SMT 3000, HotAir, PrintPerfect
- Wastewater treatment AquaPur 1000, IONEX
Products and applications
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Isolation milling (CNC milling-drilling plotter)Machining | – | – | – | – | FR4, Copper |
| Etching (spray etching, horizontal through-feed etching, vertical etching)Surface | – | – | – | – | FR4, Copper |
| Exposure (vacuum exposure, contact exposure, UV laser direct imaging)Surface | – | – | – | – | photo-coated base material |
| Drilling (PCB drilling)Machining | – | – | – | – | FR4, Base material |
| Brushing/cleaning (wet brushing)Surface | – | – | – | – | PCBs |
| Electrolytic through-hole plating (electroless-electrolytic)Surface | – | 200 mm × 300 mm | – | – | FR4, Copper |
| Mechanical through-hole plating with hollow rivetsJoining | – | – | – | – | double-sided PCBs |
| Multilayer pressing (vacuum laminating)Joining | – | – | – | – | FR4, Prepreg, Copper |
| Surface finishing: electroless nickel-gold (Ni/P & Au)Surface | – | – | – | – | Copper |
| Surface finishing: electrolytic nickel-goldSurface | – | – | – | – | Copper |
| Chemical tin plating (ORMECON, SUR-TIN)Surface | – | – | – | – | Copper |
| Dry film resist laminatingSurface | – | – | – | – | PCBs |
| Dip coating (photoresist)Surface | – | – | – | – | Base material |
| SMT assembly (pick & place, stencil printing)Assembly | – | – | – | – | PCBs |
| Reflow soldering (hot-air soldering oven, lead-free solder paste)Joining | – | – | – | – | SMD components, PCBs |
| Hot-air dryingSurface | – | – | – | – | PCBs |
| Wastewater treatment / ion exchangerSurface | – | – | – | – | – |
| Quality inspection (QualityScan 3000)Testing | – | – | – | – | PCBs |
| Film production / photoplotting (raster photoplotter)Engineering | – | – | – | – | – |
| SMD stencils / etched metal parts (metal etching)Surface | – | – | – | – | Metal |
52 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| CNC milling-drilling plotter | Bungard CCD Premium | – | – | – | Windeck |
| CNC milling-drilling plotter | Bungard CCD/2-Eco | – | – | – | Windeck |
| CNC milling-drilling plotter | Bungard CCD/2/ATC | – | – | – | Windeck |
| CNC milling-drilling plotter | Bungard CCD/2/ATC Precision | – | – | – | Windeck |
| CNC milling-drilling plotter | Bungard CCD/2/MTC | – | – | – | Windeck |
| CNC milling-drilling plotter | Bungard CCD/ATC | – | – | – | Windeck |
| CNC milling-drilling plotter | Bungard CCD/ATC/XL | – | – | – | Windeck |
| CNC milling-drilling plotter | Bungard CCD/MTC | – | – | – | Windeck |
| CNC milling-drilling plotter | Bungard CCD/MTC/XL | – | – | – | Windeck |
| Etching machine (horizontal through-feed spray etching system) | Bungard Sprint 3000/4500/6000 | – | Resolution below 0.1 mm | – | Windeck |
| Vertical etching machine | Bungard Titan 3500 | – | – | – | Windeck |
| Laboratory spray etching unit | Bungard Splash / Splash XL | – | – | – | Windeck |
| Laboratory spray etching unit with developer bath | Bungard Splash Center / Splash Center XL | – | – | – | Windeck |
| Developing and etching machine | Bungard Jet 34 d | – | Format specification incomplete | – | Windeck |
| Etching machine | Bungard Twin-Jet | – | max. etching format 350 x 980 mm | – | Windeck |
| Double-sided through-feed spray etching system | Bungard DL 500 | – | – | – | Windeck |
| Vacuum exposure unit | Bungard Hellas / Hellas LED | – | – | – | Windeck |
| Vacuum exposure unit (single-sided) | Bungard Eurolux LED | – | – | – | Windeck |
| Exposure unit (double-sided, LED) | Bungard EXP 3040 LED | – | – | – | Windeck |
| Laser exposure unit (UV laser direct imaging) | Bungard LaserPro 3000 | – | – | – | Windeck |
| Raster photoplotter | Bungard Filmstar-PLUS | – | – | – | Windeck |
| Drilling machine | Bungard Variodrill | – | – | – | Windeck |
| Wet brushing machine | Bungard RBM 300 | – | – | – | Windeck |
| Wet brushing machine | Bungard RBM 402 | – | – | – | Windeck |
| Through-hole plating system | Bungard Compacta 30 | – | Usable format 200 x 300 mm | – | Windeck |
| Through-hole plating system (electrolytic) | Bungard Compacta 40 | – | 2 individual boards simultaneously (format specification incomplete) | – | Windeck |
| Hollow rivet press (mechanical through-hole plating) | Bungard Favorit | – | – | – | Windeck |
| Electroplating system | Bungard HitecPlate 3040 | – | – | – | Windeck |
| Through-hole plating / tank system | Bungard Protec 2030/3040 | – | – | – | Windeck |
| Through-hole plating / dip coating system | Bungard Multi-Coater | – | – | – | Windeck |
| Hot-air dryer (through-feed) | Bungard AIR 2000 | – | – | – | Windeck |
| Hot-air dryer | Bungard SprintDryer | – | – | – | Windeck |
| Drying oven | Bungard ULX 110 | – | – | – | Windeck |
| Multilayer press | Bungard RMP 210 | – | – | – | Windeck |
| Multilayer press | Bungard RMP 3545 | – | – | – | Windeck |
| Multilayer press (Touch) | Bungard RMP 210/3545 Touch | – | – | – | Windeck |
| Sheet shear | Bungard Ne-Cut | – | – | – | Windeck |
| Quality control scanner | Bungard QualityScan 3000 | – | – | – | Windeck |
| Pick & Place manipulator | Bungard SMT 3000 | – | – | – | Windeck |
| Pick & Place manipulator | Bungard SMT 3000 ECO | – | – | – | Windeck |
| Soldering oven (hot air) | Bungard HotAir 06 | – | – | – | Windeck |
| Soldering oven (hot air) | Bungard HotAir 3000 | – | – | – | Windeck |
| Stencil printer | Bungard PrintPerfect 240 | – | – | – | Windeck |
| Stencil printer (manual printing) | Bungard PRINTSTAR 3000 | – | – | – | Windeck |
| Manual printing system | Bungard Stenprint 3000 | – | – | – | Windeck |
| Dry film resist laminator | Bungard RLM 419 P / 426 P | – | – | – | Windeck |
| Dip coater | Bungard RDC 15 | – | – | – | Windeck |
| Dip coater | Bungard RDC 21-K | – | – | – | Windeck |
| Dip coater | Bungard RDC 30 | – | – | – | Windeck |
| Wastewater treatment system | Bungard AquaPur 1000 | – | – | – | Windeck |
| Wastewater treatment system | Bungard IONEX A (KA) / B (KB) | – | – | – | Windeck |
| Ion exchanger | Bungard IONEX R-PM | – | – | – | Windeck |
Additional services
Quality
For quality control of PCBs, Bungard offers the QualityScan 3000 scanner. The photo-coated base material has been produced using the dip-coating process since 1961; even single-sided boards carry photoresist on both sides.
| Evidence | Windeck |
|---|---|
| QualityScan 3000 |
History
- 1961
Founded on 11.1.1961 by Heinz Bungard in Leverkusen; the business idea of photo-coated PCBs became known worldwide.
- 1978
The Hellas vacuum exposure units have been leading the world market since 1978.
- 1981
Start of distribution of ALUCOREX, photo-coated anodized aluminum.
- 2021
60 years of Bungard.