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Jentner – Fertigung

Contract electroplating from Pforzheim: reel-to-reel, rack and barrel plating with more than 15 surfaces from gold to passivation.

Jentner Logo

C. Jentner GmbH

PforzheimNew on Amplifa

2011Founded (company roots 1974)
ca. 50Employees
1 site in PforzheimProduction, laboratory and administration
800 × 600 mm / 60 kgMax. work window rack plating
Strip height 10–70 mmReel-to-reel plating, material thickness up to 1.8 mm

About C. Jentner GmbH

C. Jentner GmbH is a metal finishing specialist based in Pforzheim and part of the JentnerGroup, which looks back on more than 50 years of experience in the electroplating industry. The family business, founded in 2011 by Chris Jentner, operates as a contract electroplater for industrial customers from automotive, aerospace, defense, medical technology, electronics and mechanical engineering. Parts made of steel, stainless steel, non-ferrous metals such as copper, brass and bronze, aluminium and high-performance materials such as AlBeMet are plated. The process portfolio includes reel-to-reel plating (strip height 10–70 mm), rack plating (work window up to 800 × 600 mm, max. 60 kg) and barrel plating for small bulk parts. More than 15 surfaces are available, including electroplated gold, silver, rhodium, palladium, nickel (electroplated and electroless), tin, copper and passivations. Around 50 employees produce at the Pforzheim site with fully digitised production, patented UWB work carrier tracking and the AI system Jentner AI. Every batch is fully traceable; layer thickness measurement is performed by X-ray fluorescence analysis.

Site
Pforzheim
Processes
Reel-to-reel plating (full-area or selective), Rack plating (full or selective, masking/selective technology), Barrel plating (bulk goods, small parts 0.25 mm to 10 cm length, max. 1 cm diameter), Electroplated gold (gold-cobalt alloy, pure gold), Electroplated silver, Electroplated rhodium (rack plating only, selective possible), Electroplated palladium (rack and barrel plating, selective on rack), Electroplated nickel sulfate nickel (bright nickel, rack and barrel)
Materials
Steel, Stainless steel, Non-ferrous metals, Copper, Brass, Bronze, Aluminium, Aluminium alloys
Certificates
DIN EN 9100, DIN EN ISO 14001, DIN EN ISO 50001, Recycling Certificate, Recycling Certificate (WRC)
Founded
2011
Employees
ca. 50
Industries
Automotive, Aviation, Aerospace, Defense, Medical technology, Electronics
  1. 01

    Order acceptance and review of process suitability

  2. 02

    Sampling on request before series production

  3. 03

    Cleaning and pretreatment

  4. 04

    Electroplated or chemical coating (reel-to-reel, rack or barrel plating)

  5. 05

    Passivation as post-treatment

  6. 06

    XRF layer thickness measurement and batch release

  7. 07

    Documentation and shipping

Pforzheim Site

Standort Pforzheim

Pforzheim

DE

Production, laboratory and administration

Part weight / size
Work window 800 × 600 mm, max. 60 kg (rack)
Lot size
From single parts to large series
Materials
Steel, stainless steel, non-ferrous metals, aluminium, AlBeMet
  • Reel-to-reel plating line (strip height 10–70 mm, up to 1.8 mm material thickness)
  • Rack plating line (work window 800 × 600 mm)
  • Barrel plating line
  • XRF layer thickness measuring device
  • Laboratory with ICP-OES, AAS, photometer, FTIR
  • UWB tracking system and Jentner AI
  • 300 kWp photovoltaic system

Plated Parts

Gold-plated part
Gold-plated partRack plating · Electronics
Silver-plated contact part
Silver-plated contact partReel-to-reel/rack/barrel plating · Electronics
Rhodium-plated contact part
Rhodium-plated contact partRack plating · Medical technology
Palladium-coated bonding part
Palladium-coated bonding partRack/barrel plating · Electronics
Cr-III passivated aluminium part
Cr-III passivated aluminium partRack plating · Automotive
Tin-zinc coated part
Tin-zinc coated partRack plating · Aerospace
Tin-plated contact
Tin-plated contactReel-to-reel/rack/barrel plating · Electronics
Copper-coated substrate
Copper-coated substrateRack/barrel plating · Mechanical engineering
Nickel-plated part
Nickel-plated partRack/reel-to-reel/barrel plating · Mechanical engineering
Electroless nickel coated part
Electroless nickel coated partRack plating · Mechanical engineering

Inside the production

Reel-to-reel plating line with continuous stamped strip
Reel-to-reel plating line with continuous stamped strip
Automatic rack plating line
Automatic rack plating line
Barrel plating line
Barrel plating line
Rack plating in production
Rack plating in production
XRF layer thickness measurement in quality assurance
XRF layer thickness measurement in quality assurance
Jentner AI, digital dashboard for process monitoring
Jentner AI, digital dashboard for process monitoring
Collaborative robot in automated manufacturing
Collaborative robot in automated manufacturing
Rack plating production in Pforzheim
Rack plating production in Pforzheim

Industries

AutomotiveAviationAerospaceDefenseMedical technologyElectronicsMechanical engineering

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
Reel-to-reel plating (full-area or selective)Surface–Strip height 10–70 mm––Stainless steel, Non-ferrous metals
Rack plating (full or selective, masking/selective technology)Surface–up to 800 mm × up to 600 mmmax. 60 kg per single partSingle part – Large seriesSteel, Stainless steel, Non-ferrous metals, Aluminium, High-performance materials such as AlBeMet
Barrel plating (bulk goods, small parts 0.25 mm to 10 cm length, max. 1 cm diameter)Surface–––Single order – Large seriesStainless steel, Non-ferrous metals
Electroplated gold (gold-cobalt alloy, pure gold)Surface––––Steel, Stainless steel, Copper, Brass, Bronze, Aluminium, AlBeMet
Electroplated silverSurface–Strip height 10–70 mm––Stainless steel, Copper, Brass, Bronze, Steel, Aluminium, AlBeMet
Electroplated rhodium (rack plating only, selective possible)Surface–up to 800 mm × up to 600 mm––Steel, Stainless steel, Non-ferrous metals, Aluminium, High-performance materials
Electroplated palladium (rack and barrel plating, selective on rack)Surface–up to 800 mm × up to 600 mm––Stainless steel, Copper, Brass, Bronze, Steel, Aluminium, AlBeMet
Electroplated nickel sulfate nickel (bright nickel, rack and barrel)Surface––––Stainless steel, Copper, Brass, Bronze, Steel, Aluminium, AlBeMet
Electroplated nickel sulfamate nickel (rack, strip and barrel, low-stress)Surface–Strip height 10–70 mm––Stainless steel, Copper, Brass, Bronze, Steel, Aluminium, AlBeMet
Electroless nickel (mid-phos, electroless, rack plating only)Surface–up to 800 mm × up to 600 mm––Steel, Stainless steel, Non-ferrous metals, Aluminium, AlBeMet
Electroless nickel (high-phos, corrosion-resistant, practically non-magnetic, rack plating only)Surface–up to 800 mm × up to 600 mm––Steel, Stainless steel, Non-ferrous metals, Aluminium, AlBeMet
Electroplated bright tin (rack plating only, selective possible)Surface–up to 800 mm × up to 600 mm––Steel, Stainless steel, Copper, Brass, Bronze, Aluminium, AlBeMet
Electroplated matte tin (reel-to-reel, rack and barrel plating, selective on strip and rack)Surface–Strip height 10–70 mm––Stainless steel, Copper, Brass, Bronze, Steel, Aluminium, AlBeMet
Electroplated tin-zinc (cadmium replacement, rack plating only, selective possible)Surface–up to 800 mm × up to 600 mm––Steel, Stainless steel, Non-ferrous metals, Aluminium (with nickel intermediate layer), High-performance materials
Electroplated copper cyanide (rack and barrel plating, strike layer, high throwing power)Surface–up to 800 mm × up to 600 mm––Steel, Zinc die-cast, Brass, Bronze
Electroplated copper acid (rack plating only, high deposition rate, ductile, bright)Surface–up to 800 mm × up to 600 mm––Steel, Stainless steel, Non-ferrous metals, Aluminium, AlBeMet
Stainless steel passivation (nitric acid immersion bath, chemical, within rack plating)Surface–up to 800 mm × up to 600 mm––Stainless steel
Cr-III passivation for aluminium (SurTec 650, chromium conversion layer, Cr-VI-free, rack goodsSurface–up to 800 mm × up to 600 mm––Aluminium, Aluminium alloys
Passivation (thiol, organic tarnish protection for strip, rack and barrel goods)Surface––––Silver, Copper
Passivation (tin-based, metallic tarnish protection, rack and barrel goods)Surface––––Silver
Layer thickness measurement by X-ray fluorescence analysis (XRF), batch releaseTesting–––––

6 Anlagen & Maschinen

MachineManufacturer / modelQuantityWorking areaYear builtSite
Reel-to-reel plating line–1Strip height 10–70 mm, material thickness up to 1.8 mm–Pforzheim
Reel-to-reel plating line (second line, planned from 2027, larger strip formats)–1–2027Pforzheim
Rack plating line––Work window up to 800 × 600 mm, max. 60 kg2023 (NeubPforzheim
Barrel plating line––Small parts 0.25 mm to 10 cm length, max. 1 cm diameter–Pforzheim
X-ray fluorescence measuring device (XRF) for layer thickness measurement––––Pforzheim
Laboratory analysis (ICP-OES, AAS, photometer, FTIR) for bath monitoring––––Pforzheim

Additional services

Reel-to-reel platingRack platingBarrel platingSelective coatingSample parts and small seriesBatch traceabilityLayer thickness measurement by X-ray fluorescence analysisBath analysis in own laboratoryStainless steel passivationCr-III passivation (SurTec 650)Thiol passivationTin-based passivationCustomer auditsSampling

Quality and Certifications

A laboratory within production regularly monitors the baths by ICP-OES, AAS, photometer and FTIR; layer thickness and composition are measured on the part by X-ray fluorescence analysis. A patented UWB tracking system and the AI system Jentner AI document every batch completely and traceably.

EvidencePforzheim
DIN EN 9100
DIN EN ISO 14001
DIN EN ISO 50001
Recycling Certificate (WRC)

History of the JentnerGroup

  1. 1974

    Kurt Jentner founds the company as a supplier of chemicals and small electroplating systems for decorative metal finishing to jewellers and goldsmiths.

  2. 1999

    Chris Jentner takes over the management from his father and becomes sole owner.

  3. 2001

    Entry into contract electroplating with own barrel and rack plating.

  4. 2011

    Foundation of C. Jentner GmbH as an independent company focused on contract electroplating.

  5. 2015

    Takeover of the electroplating operations of C. Hafner GmbH + Co. KG, expansion into technical electroplating.

  6. 2020

    Strategic realignment from decorative to technical surfaces; focus on digitalisation, from which the patented UWB tracking later emerges.

  7. 2023

    New building with company restaurant, rack plating and production space; launch of Jentner AI.

  8. 2024

    Tobias Kleiber joins the management.

  9. 2025

    DIN EN 9100 certification, introduction of reel-to-reel plating and AI applications in production.

  10. 2026

    Capacity expansion: second strip plating line ordered (from 2027), rollout of Jentner AI, acquisition of the neighbouring property.

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