EMS provider: development and manufacturing of electronics, plastic and metal components up to the fully assembled device
Delfi Tech Deutschland GmbH
Harrislee · Kirchzarten · Auerbach/Vogtland · Dresden · Kempten · Zimmern ob Rottweil · Sønderborg · Nagykanizsa · Budapest · Lechaschau · Shenzhen · Hong KongNew on Amplifa
About the Delfi Group
The Delfi Group is an internationally positioned corporate group in the field of electronics manufacturing (EMS) with manufacturing and development sites in Germany, Austria, Hungary, China and Hong Kong as well as a site in Denmark. The service portfolio includes system development, prototyping, electronics development (hardware, software, firmware), PCBA, cable assembly, mechanical and optomechanical development, toolmaking and plastic injection molding in 1K and 2K processes. Manufacturing resources include up to five SMT lines per electronics plant, 70 1K injection molding machines (clamping force 400–32000 kN, part weight 0.5–8800 g) and five 2K machines. Metalworking comprises stamping, bending, CNC milling, wire EDM and surface grinding; in addition, the group offers hardening, assembly with automation, testing facilities and after-sales service. Customers come from medical and pharmaceutical technology, automotive, power electronics, energy technology and the electronics industry. All sites share identical corporate structures and production facilities with consistently high quality.
- Site
- Harrislee
- Processes
- PCB assembly (SMT, up to 5 SMT lines per plant), Aluminum and gold wire bonding on PCB and ceramics, Cleanroom electronics production, Through-hole technologies (THT), Reflow, wave and selective soldering, X-ray inspection, Laser engraving, Flying probe, ICT and functional testing
- Materials
- Aluminum, Zinc, Gold, Ceramics, PEEK, Glass-fiber-reinforced high-temperature-resistant plastics, Plastic injection molding 1K/2K, PCB assembly SMT/THT
- Certificates
- DIN EN ISO 9001, DIN EN ISO 13485:2012, IATF 16949, EN ISO 14001, OHSAS 18001, BSCI (recognition/implementation), ISO 9001, ISO 13485, ISO 14001, BSCI
- Industries
- Medical/pharmaceutical technology, Automotive, Power electronics, Energy technology, EMS/Electronics, Energy technology/energy technology components
- 01
System development (electronics, mechanics, thermal management)
- 02
Prototyping
- 03
Toolmaking (injection molding, stamping technology)
- 04
PCB assembly / PCBA
- 05
Plastic injection molding 1K/2K
- 06
Metalworking (stamping, CNC milling, wire EDM, grinding)
- 07
Assembly and automation
- 08
Testing (AOI, ICT, Flying Probe, X-Ray, functional test)
- 09
After-sales service
Materials and Processes
Plastic injection molding 1K/2K
70 1K and 5 2K machines (400–32000 kN) for parts from 0.5 g to 8,800 g.
PEEK
High-performance plastic for technical injection molding functions.
Glass-fiber-reinforced high-temperature-resistant plastics
For stressed, temperature-resistant functional parts.
PCB assembly SMT/THT
Up to five SMT lines per plant, complemented by THT, reflow, wave and selective soldering.
Aluminum and gold wire bonding
Bonding on PCB and ceramics for electronic and power electronics applications.
Stamping and bending
Precision and fineblanking, stamping/bending and insert molding technology for contacts and sheet metal components.
CNC milling
Working range 600 × 1,100 × 570 mm in mechatronics manufacturing.
Wire EDM (EDM)
Working range 600 × 800 × 500 mm for precise tools and molded parts.
Surface grinding
Working range 500 × 1,000 × 300 mm for flat precision surfaces.
Aluminum and zinc die casting
Toolmaking and manufacturing of die-cast components made of aluminum and zinc.
Hardening shop
In-house hardening facility for heat treatment in toolmaking.
3D printing
Development and design of parts for 3D printing.
Components and Services
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| PCB assembly (SMT, up to 5 SMT lines per plant)Assembly | – | – | – | – | PCB, ceramics |
| Aluminum and gold wire bonding on PCB and ceramicsAssembly | – | – | – | – | aluminum, gold, ceramics |
| Cleanroom electronics productionAssembly | – | – | – | – | – |
| Through-hole technologies (THT)Assembly | – | – | – | – | – |
| Reflow, wave and selective solderingJoining | – | – | – | – | – |
| X-ray inspectionTesting | – | – | – | – | – |
| Laser engravingSurface | – | – | – | – | – |
| Flying probe, ICT and functional testingTesting | – | – | – | – | – |
| Automatic painting and potting systemsSurface | – | – | – | – | – |
| AOI (in-line and off-line systems)Testing | – | – | – | – | – |
| Cable assemblyAssembly | – | – | – | – | – |
| PCBA (printed circuit board assembly)Assembly | – | – | – | – | – |
| Standard stampingForming | – | – | – | – | metal |
| FineblankingForming | – | – | – | – | metal |
| Stamping/bendingForming | – | – | – | – | metal |
| Insert molding technology / contact assemblyForming | – | – | – | – | metal |
| Integrated welding processesJoining | – | – | – | – | metal |
| CNC millingMachining | – | 1100 mm × 600 mm × 570 mm | – | – | metal |
| Wire EDM (EDM)Machining | – | 800 mm × 600 mm × 500 mm | – | – | metal |
| Surface grindingMachining | – | 1000 mm × 500 mm × 300 mm | – | – | metal |
| Part finishing with Rössler Trowal and degreasingSurface | – | – | – | – | metal |
| Hardening shop for toolmakingHeat treatment | – | – | – | – | tool steel |
| Toolmaking injection molds (2K, 3K, stack molds, segmented molds)Engineering | – | – | – | – | steel |
| Toolmaking stamping technologyEngineering | – | – | – | – | – |
| Plastic injection molding 1K (70 machines)Plastics | – | – | 0.5 g – 8800 g | – | plastics, PEEK, glass-fiber-reinforced plastics |
| Plastic injection molding 2K (5 machines)Plastics | – | – | 998/217 g | – | plastics |
| Toolmaking aluminum die castingCasting | – | – | – | – | aluminum |
| Toolmaking zinc die castingCasting | – | – | – | – | zinc |
| Assembly + automation (fully assembled devices)Assembly | – | – | – | – | – |
| PrototypingAssembly | – | – | – | – | – |
| Test facilities (special machinery construction)Testing | – | – | – | – | – |
| Special machinery/device constructionAssembly | – | – | – | – | – |
9 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMT line | – | up to 5 | – | – | Hungary (Nagykanizsa, Budapest) and China (Shenzhen) |
| 1K injection molding machine | – | 70 | – | – | Hungary and Germany |
| 2K injection molding machine | – | 5 | Clamping force 1300–6500 kN | – | Hungary and Germany |
| CNC milling machine | – | – | 600 x 1,100 x 570 mm | – | Mechatronics (DE, AT, HU) |
| Wire EDM machine (EDM) | – | – | 600 x 800 x 500 mm | – | Mechatronics (DE, AT, HU) |
| Surface grinding machine | – | – | 500 x 1,000 x 300 mm | – | Mechatronics (DE, AT, HU) |
| Hardening furnace | – | – | – | – | Mechatronics (DE, AT, HU) |
| Trowal vibratory finishing system | Rössler Trowal | – | – | – | Mechatronics (DE, AT, HU) |
| 1K injection molding machine (range) | – | – | Clamping force 400–32000 kN | – | Hungary and Germany |
Additional services
Quality and Certifications
All sites maintain identical quality structures with certifications according to DIN EN ISO 9001, DIN EN ISO 13485, IATF 16949 and EN ISO 14001. Electronics manufacturing uses AOI systems, X-ray, flying probe, ICT and functional testing, stress tests as well as cleanroom production.
| Evidence | Delfi Group (all sites) |
|---|---|
| ISO 9001 | |
| ISO 13485 | |
| IATF 16949 | |
| ISO 14001 | |
| OHSAS 18001 | |
| BSCI |