Development and EMS manufacturing of electronic assemblies: hardware, firmware, SMD/THT assembly and IoT solutions from a single source
EBS-SYSTART GmbH
Gröbenzell (DE) · Bulgaria (BG)New on Amplifa
About EBS-SYSTART
EBS-SYSTART GmbH is an engineering office with its own electronics manufacturing facility in Gröbenzell near Munich. The company develops and manufactures custom electronics solutions from the initial idea through hardware and firmware design (embedded systems, microcontrollers) to SMD and THT assembly, module assembly and series production. The manufacturing operation specializes in prototypes, small series and medium series, with double-sided SMD assembly down to component size 0201, vapor phase and reflow soldering as well as machine-selective soldering. In addition, functional and end-of-line tests, EMC qualification, CE-preparation work, test equipment development, power electronics development up to 16 kW, white-label electronics solutions and the IoT cloud platform IoTART are offered. Customers come from industries such as mechanical engineering, automation, robotics, medical technology, laser technology and energy; since 2021 there has been a branch for development and production in Bulgaria.
- Site
- Gröbenzell
- Processes
- SMD assembly (smallest components down to 0201, double-sided, fully automated with two SMD lines), Stencil printing (EKRA E4/E5, PAGGEN TDS-360, manual squeegees for prototypes), Pick and place (placement machines, manual placement with tweezers), Reflow soldering, Vapor phase soldering (thermally gentle, oxidation-free, soldering profile storage), THT assembly, Machine-selective soldering (nitrogen protective atmosphere), Manual selective soldering / hand assembly
- Materials
- Printed circuit boards (PCB), Solder alloy, Printed circuit boards, Vapor phase soldering, Selective soldering, 3D printing
- Certificates
- DIN EN ISO 9001:2015, ISO 9001
- Founded
- 2010
- Employees
- 29
- Industries
- Mechanical engineering, Industrial automation, Robotics, Medical technology, Logistics, Automotive industry
- 01
Electronics development (hardware, firmware, mechanics)
- 02
Component procurement
- 03
Stencil printing
- 04
SMD assembly / THT assembly
- 05
Soldering (reflow, vapor phase, selective)
- 06
AOI & ICT
- 07
Module assembly
- 08
Functional test / end-of-line test
- 09
ESD-compliant packaging
Processes & Manufacturing Technology
Printed circuit boards
Carrier material for SMD and THT assembly, double-sided assembly possible in all common package types.
Vapor phase soldering
Thermally gentle, oxidation-free soldering process with soldering profile storage for sensitive assemblies.
Selective soldering
Machine-selective soldering of through-hole components under a nitrogen protective atmosphere.
3D printing
Production of mechanical prototypes, e.g. display holders for evaluations.
Locations
Gröbenzell
DEHeadquarters: development, EMS manufacturing, sales
- Lot size
- Prototypes, small and medium series
- Materials
- Printed circuit boards, SMD and THT components
- 2 SMD lines (Siplace F4)
- EKRA stencil printers E4/E5
- ASSCON batch vapor phase VP1000-66
- ERSA selective soldering system ECOSELECT 1
- 3D AOI
- ICT in-circuit tester
- Hot-air soldering station / rework
Bulgaria
BGBranch for development and production
Components & Products
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD assembly (smallest components down to 0201, double-sided, fully automated with two SMD lines)Assembly | – | – | – | Prototypes/single pieces – medium series | Printed circuit boards (PCB) |
| Stencil printing (EKRA E4/E5, PAGGEN TDS-360, manual squeegees for prototypes)Assembly | – | – | – | – | Printed circuit boards (PCB), Solder paste |
| Pick and place (placement machines, manual placement with tweezers)Assembly | – | – | – | Single piece/prototype – medium series | SMD components |
| Reflow solderingJoining | – | – | – | – | Printed circuit boards (PCB) |
| Vapor phase soldering (thermally gentle, oxidation-free, soldering profile storage)Joining | – | – | – | – | Printed circuit boards (PCB) |
| THT assemblyAssembly | – | – | – | – | Printed circuit boards (PCB), through-hole components |
| Machine-selective soldering (nitrogen protective atmosphere)Joining | – | – | – | – | Printed circuit boards (PCB), through-hole components |
| Manual selective soldering / hand assemblyJoining | – | – | – | – | Printed circuit boards (PCB) |
| Wave soldering (mentioned as a THT process)Joining | – | – | – | – | Printed circuit boards (PCB) |
| Rework work (hot-air soldering station, infrared preheating devices) and sample buildingAssembly | – | – | – | – | Printed circuit boards (PCB) |
| Module assembly (cable assembly, pressing in of special connectors, screwing in ofAssembly | – | – | – | Prototypes – series | Electronic assemblies |
| Component procurement / packing service / ESD-compliant packagingAssembly | – | – | – | – | Electronic assemblies |
| Functional test / commissioning / end-of-line test (test field)Testing | – | – | – | – | Electronic assemblies |
| ICT (in-circuit test)Testing | – | – | – | – | Electronic assemblies |
| AOI (3D automatic optical inspection)Testing | – | – | – | – | Electronic assemblies |
| EMC qualification (measurements and tests according to relevant standards)Testing | – | – | – | – | Electronic assemblies |
| CE-preparation work (documents, tests, documentation)Testing | – | – | – | – | – |
| Test equipment development and test equipment constructionEngineering | – | – | – | – | – |
| Hardware development (circuit diagram, PCB layout, EMC-compliant design)Engineering | – | – | – | – | Printed circuit boards (PCB) |
| Firmware development (embedded systems & microcontrollers)Engineering | – | – | – | – | – |
| Power electronics development (custom switching power supplies/power supply units up to 16 kW,Engineering | – | – | – | – | – |
| Mechanical development (enclosure design, 3D design, CAD tools)Engineering | – | – | – | – | – |
| 3D printing of mechanical prototypesAdditive | – | – | – | – | Plastic (prototypes) |
| IoT cloud platform development (IoTART, Angular, .NET Core, MSSQL/PostgreSQL)Engineering | – | – | – | – | – |
11 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMD placement machine (SMD line) | Siplace Siplace F4 | 2 (two | – | 2014 (erst | Gröbenzell |
| Stencil printer | EKRA E4 | 1 | fully automatic print image inspection, fine pitch | – | Gröbenzell |
| Stencil printer | EKRA E5 | 1 | series products or prototypes with fine pitch | – | Gröbenzell |
| Stencil printer (manual, hand squeegee) | PAGGEN TDS-360 | 1 | prototypes, low-cost/free stencils | – | Gröbenzell |
| Vapor phase soldering system (batch) | ASSCON Systemtechnik Elektronik GmbH VP1000-66 (soldering profile storage) | 2 | – | 2015 (groß | Gröbenzell |
| Selective soldering system | ERSA GmbH ECOSELECT 1 | 1 | spray flux system, preheating modules, 2 solder pots with 15 kg solder alloy each, nitrogen | 2016 | Gröbenzell |
| 3D AOI (automatic optical inspection) | – | 1 | process control of SMD assembly | 2018 | Gröbenzell |
| ICT (in-circuit tester) | – | 1 | maximum test coverage | 2018 | Gröbenzell |
| Hot-air soldering station (rework) | – | – | – | – | Gröbenzell |
| Infrared preheating devices (rework) | – | – | – | – | Gröbenzell |
| Soldering stations (manual soldering) | – | – | – | – | Gröbenzell |
Additional services
Quality
The processes have been certified to DIN EN ISO 9001:2015 since 25.07.2014. The test field includes 3D AOI, in-circuit testing (ICT), functional tests/end-of-line tests as well as EMC qualification and CE-preparation work.
| Evidence | Gröbenzell |
|---|---|
| ISO 9001 |
History
- 2010
Founding of SYSTART GmbH by Michael Bittner as a one-man company; establishment of prototype manufacturing and an online calculator for prototype assembly.
- 2011
First development orders (consumer electronics, smart metering); acquisition of the first placement machine.
- 2012
Development orders for controls of punching machines and laser systems; first employees in development.
- 2013
Orders in the field of GPS tracking, mobile communications and sensor technology; first employee in production.
- 2014
Certification to ISO 9001; team of 6 colleagues; switch to Altium CAD; Siplace F4 placement machine.
- 2015
Expansion of the development rooms to approx. 110 m²; acquisition of a large batch vapor phase system.
- 2016
Transition to small-series assembly; acquisition of a selective soldering system with two solder pots.
- 2017
Takeover of the EMS service provider EBS Electronic GmbH; move into its premises.
- 2018
Merger to form EBS-SYSTART GmbH; acquisition of 3D AOI and ICT.
- 2019
Reorganization of production and warehouse; air conditioning of the production rooms.
- 2020
Implementation of a second, identical SMD line; new compressors.
- 2021
New ERP system; establishment of the branch in Bulgaria; team of 29 colleagues.