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Kappler CNC – Fertigung

Ultra-precise CNC machining, additive manufacturing and joining technology for the high-tech industry in Birkenfeld.

Kappler CNC Logo

Kappler GmbH & Co. KG

BirkenfeldNew on Amplifa

1934Founded
>200Employees
36,500 m²Production area
>140CNC machines
12,000 x 4,200 x 2,000 mmMax. component size, milling

Company

Kappler CNC manufactures ultra-precise components, assemblies and fixtures for the semiconductor industry (EUV and DUV technologies), the optical industry, aerospace, energy and infrastructure, medical technology, and general mechanical engineering. The service portfolio includes 5-axis milling (components up to 12,000 x 4,200 x 2,000 mm), turn-mill machining, Swiss-type turning, grinding, ultra-precision machining with 4 µm positioning accuracy, ultrasonic machining of glass, ceramics and hard metals, EDM, selective laser melting (SLM) as well as joining processes such as friction stir welding, TIG, MIG/MAG, laser and electron beam welding, diffusion welding and brazing/soldering. Additional services include surface treatment, heat treatment and holistic project management including technology development and process qualification. More than 200 employees produce at a 36,500 m², climate-controlled, vibration-damped and automated site in Birkenfeld with more than 140 CNC machines. Quality assurance is carried out, among other things, with Zeiss coordinate measuring machines for large components up to 8,000 mm measuring length.

Site
Birkenfeld
Processes
CNC milling technology (5-axis, automation), CNC turning technology (turn-mill centers, Swiss-type turning), Grinding technology, Additive manufacturing (SLM, LASERTEC 30 SLM), Ultrasonic/HSC machining, CNC EDM (wire and sinker EDM), Friction stir welding, TIG, MIG/MAG and laser welding
Materials
Glass, Ceramics, Hard metals
Certificates
ISO 9001, DIN EN ISO 14001, Measuring process assessment (MPA) by Carl Zeiss IMT
Founded
1934
Employees
>200
Industries
Semiconductor industry (EUV/DUV), Optical industry, Aerospace, Energy and infrastructure, Medical technology, Mechanical engineering
  1. 01

    Project management & feasibility analysis

  2. 02

    CNC milling (5-axis)

  3. 03

    CNC turning / Swiss-type turning

  4. 04

    Grinding

  5. 05

    Ultrasonic/HSC machining

  6. 06

    EDM

  7. 07

    Additive manufacturing (SLM)

  8. 08

    Joining (welding, brazing/soldering)

  9. 09

    Surface treatment

  10. 10

    Heat treatment (annealing, ageing)

  11. 11

    Quality assurance / metrology

  12. 12

    Assembly

Locations

Standort Birkenfeld

Birkenfeld

DE

Production site (36,500 m²), climate-controlled and automated manufacturing

Part weight / size
Milled parts up to 12,000 x 4,200 x 2,000 mm
Lot size
n/a
Materials
Metals, glass, ceramics, hard metals
  • 5-axis machining centers
  • 3x Hermle C42 robot cell
  • DMG 340 µ-precision
  • DMG 210 µ-precision
  • DMG CTX beta TC
  • DMG CTX gamma TC
  • DMG NTX 3000 with robot
  • Traub TNL Swiss-type lathe
  • Vertical grinding machine with pallet changer
  • DMG LASERTEC 30 SLM
  • 2x Sauer ultrasonic 5-axis
  • Zeiss MMZ-M CMM
  • Zeiss MMZ-G CMM
  • ZeroClamp / DMG Robo2Go / PH cell / Hermle HS flex

Components

Precision component
Precision component5-axis milling · Semiconductor industry
Precision component
Precision componentCNC turning technology · Mechanical engineering
Component
ComponentSLM · Optical industry
Component
ComponentUltrasonic machining · Research

Inside the production

Production hall Birkenfeld
Production hall Birkenfeld
CNC manufacturing
CNC manufacturing
Machine technology
Machine technology
Manufacturing environment
Manufacturing environment
Production area
Production area
Automation
Automation
Metrology
Metrology
Birkenfeld site
Birkenfeld site

Industries

Semiconductor industry (EUV/DUV)Optical industryAerospaceEnergy and infrastructureMedical technologyMechanical engineeringOptical industry (space telescopes, electron microscopes)Energy and infrastructure (wind turbine machinery, gas pipelines)

15 Anlagen & Maschinen

MachineManufacturer / modelQuantityWorking areaYear builtSite
5-axis machining centers (with rotary tables)–1max. component 12,000 x 4,200 x 2,000 mm–Birkenfeld
Robot cell with linear robotHermle C423––Birkenfeld
Ultra-precision machining centers µ-precisionDMG MORI DMG 340 µ-precision1––Birkenfeld
Ultra-precision machining centers µ-precisionDMG MORI DMG 210 µ-precision1––Birkenfeld
Turn-mill center with 5-axis simultaneous machiningDMG MORI CTX beta TC1––Birkenfeld
Turn-mill center with 5-axis simultaneous machiningDMG MORI CTX gamma TC1––Birkenfeld
Turn-mill center with robotDMG MORI NTX 30001––Birkenfeld
Swiss-type latheTraub TNL1Machining up to Ø 40 mm–Birkenfeld
Vertical grinding machine with pallet changer–1max. 2000 x 1000 x 1000 mm–Birkenfeld
SLM system (quad laser, 600 W each)DMG MORI LASERTEC 30 SLM 3rd generation1325 x 325 x 400 mm, layer thickness from 30 µm–Birkenfeld
Ultrasonic machines (5-axis)Sauer2––Birkenfeld
Coordinate measuring machine for large componentsZeiss MMZ-M13000 x 6000 x 2000 mm–Birkenfeld
Coordinate measuring machine for large componentsZeiss MMZ-G14000 x 8000 x 3000 mm–Birkenfeld
Coordinate measuring machinesZeiss2––Birkenfeld
Pallet changer magazines / automation (ZeroClamp, DMG Robo2Go, PH cell, Hermle HS flex)–1––Birkenfeld

Additional services

CNC milling technology (5-axis, automation)CNC turning technology (turn-mill centers, Swiss-type turning)Grinding technologyAdditive manufacturing (SLM, LASERTEC 30 SLM)Ultrasonic/HSC machiningCNC EDM (wire and sinker EDM)Friction stir weldingTIG, MIG/MAG and laser weldingElectron beam weldingDiffusion weldingBrazing/solderingLaser marking/engravingPaintingWaterjet cuttingHeat treatment (annealing, ageing)Cleanroom technologyTechnology development / process qualificationQuality assurance / metrology (Zeiss CMMs up to 8000 mm)Holistic project management

Reference customers

DMG MORI (Success Stories)Axon

Quality

Quality assurance is performed with Zeiss coordinate measuring machines (up to 4,000 x 8,000 x 3,000 mm for large components), 3D scanners, digital microscopes, helium leak testing down to <1x10-11 mbar*l/s, and pressure and stress testing up to 15 bar in vibration-damped, climate-controlled and cleanroom-filtered measuring rooms. In addition, hardness, magnetism, conductivity and volume flow tests are used, as well as ultrasonic, CT and metallographic inspections via partners.

EvidenceBirkenfeld
ISO 9001
DIN EN ISO 14001
Measuring process assessment (MPA) by Carl Zeiss IMT

History

  1. 1934

    Friedrich Kappler registers the company in Gräfenhausen-Birkenfeld; self-employment begins with a press machine in the cellar.

  2. 1938

    Relocation to Karlsruher Straße in Gräfenhausen; customers include Marwitz und Hauser, Stuttgart.

  3. 1950-1960er

    Reconstruction, manufacture of bench drilling machines; deliveries to Salamander (fixtures, stamping dies, tools).

  4. 1967

    After the accidental death of Friedrich Kappler (1965), his daughter Hildegard Gottschling and her husband Willy Gottschling take over the company.

  5. 1970/71

    Conversion into a production hall; later construction of machines for jewellery chain manufacturing (up to 480/year) and eyewear parts.

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