Laser contract manufacturing for micromachining and plastics welding in the micrometer range.
LaserMicronics GmbH
GarbsenNew on Amplifa
About LaserMicronics
LaserMicronics GmbH is a laser contract manufacturing service provider based in Garbsen near Hanover and a subsidiary of LPKF Laser & Electronics SE. The company offers micromachining and laser plastic welding with UV, IR and ultrashort-pulse laser systems (picoseconds, PicoLine). The service portfolio includes laser plastic welding for thermoplastics, laser drilling of microvia holes from 50 µm, laser cutting of micro parts from sheet metal up to 4 mm thick, cutting of rigid, rigid-flex and flexible printed circuit boards with UV laser, repairs by ablation of solder resists and cover films, micromachining of ceramics (cutting, drilling, scribing, engraving, marking) and laser processing of TCO/ITO layers. Application engineers support projects from feasibility studies to series production; lot sizes range from small series to volume production. Customers come from medical technology, automotive, electronics, consumer products and the solar industry.
- Site
- Garbsen
- Processes
- Laser plastic welding, Laser drilling (microvia holes), Laser cutting of cut parts (sheet metal), Laser cutting of printed circuit boards (UV laser), Laser repairs (ablation of solder resists and cover films), Micromachining of ceramics (cutting, drilling, scribing, engraving, marking), TCO/ITO laser processing (isolations on TCO layers), Laser drilling (microvia holes from 50 µm)
- Materials
- Ceramics, Plastics (thermoplastics), Sheet metal (metal), Printed circuit board base material, TCO/ITO layers, Materials machinable with UV, IR and ultrashort pulses, UV, IR and ultrashort-pulse laser systems, Ultrashort-pulse laser technology (picoseconds)
- Certificates
- Certifications
- Founded
- 2003
- Industries
- Medical technology, Automotive, Electronics, Consumer products, Solar industry
- 01
Feasibility study and application support
- 02
Laser processing (cutting, drilling, welding, ablation)
- 03
Quality control
- 04
Series production
Materials and laser processes
UV, IR and ultrashort-pulse laser systems
Cover a broad spectrum of materials and processes in laser micromachining.
Ultrashort-pulse laser technology (picoseconds)
LPKF PicoLine systems for precise, contact-free micromachining.
Plastics (thermoplastics)
Material for contact-free laser plastic welding.
Printed circuit board base material
Rigid, rigid-flex and flexible printed circuit boards for cutting, drilling and repairs.
Ceramics
Cutting, drilling, scribing, engraving and marking of technical ceramics.
TCO/ITO layers
Creation of the finest isolations on transparent conductive layers.
Sheet metal (metal)
Laser cutting of cut parts up to 4 mm thick.
Locations
Garbsen
DELaser contract manufacturing and application center
- Lot size
- Small series to series production
- Materials
- Thermoplastics, printed circuit boards, ceramics, sheet metal, TCO/ITO layers
- UV laser systems
- IR laser systems
- Ultrashort-pulse laser systems (PicoLine)
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Laser plastic weldingJoining | – | – | – | Series production | Plastics (thermoplastics) |
| Laser drilling (microvia holes)Machining | – | – | – | – | Printed circuit boards / base material |
| Laser cutting of cut parts (sheet metal)Machining | – | 4 mm thickness | – | – | Sheet metal |
| Laser cutting of printed circuit boards (UV laser)Machining | – | – | – | – | Printed circuit boards (flexible, rigid-flex, rigid) |
| Laser repairs (ablation of solder resists and cover films)Surface | – | – | – | – | Printed circuit boards, solder resist, cover films |
| Micromachining of ceramics (cutting, drilling, scribing, engraving, marking)Machining | – | – | – | – | Ceramics |
| TCO/ITO laser processing (isolations on TCO layers)Surface | – | – | – | – | TCO/ITO layers, Glass |
3 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| UV laser systems | LPKF | – | – | – | – |
| IR laser systems | LPKF | – | – | – | – |
| Ultrashort-pulse laser systems (picoseconds) | LPKF PicoLine | – | – | – | – |
Additional services
Quality
Application engineers support projects from the feasibility study through to ongoing series production, thereby ensuring precision in the micrometer range.
| Evidence | Garbsen |
|---|---|
| Certifications |
History
- 2003
Foundation of an application center for laser applications by LPKF; development of 3D-MID technology to series maturity; transfer to the subsidiary LaserMicronics GmbH
Over 30 years of experience in laser contract manufacturing according to the company's own statement