EMS service provider for SMD/THT assembly, assembly of complex electronic solutions, and device assembly.
paratus electronic GmbH
Flintbek (Headquarters / Production)New on Amplifa
About paratus electronic
paratus electronic GmbH is an EMS service provider (Electronic Manufacturing Services) based in Flintbek (Schleswig-Holstein) for the manufacturing of custom flat printed circuit boards (PCBs) and electronic device components. The scope of services includes automated SMD assembly including BGA and µBGA components from 01005 package size, THT assembly, reflow and vapor phase soldering according to IPC standards, as well as assembly of assemblies and devices from partial assembly to complete unit. For quality assurance, automated optical inspection (AOI), X-ray inspection of solder joints for BGA/QFN, and functional tests are used; voids under BGAs are reduced through optimized soldering profiles. Furthermore, the company provides development, international material procurement through a supplier network in Europe, Asia, and North America, and obsolescence management. The manufacturing addresses safety-critical industries such as rail technology, wind energy, medical technology, maritime technology, battery management, energy, and industry, as well as mechanical engineering, from prototype series to mass production.
- Site
- Flintbek
- Processes
- SMD PCB Assembly (Surface Mounted Device), THT PCB Assembly (Through-Hole Technology), BGA & µBGA Assembly, Reflow Soldering (according to IPC standards), Vapor Phase Soldering (according to IPC standards), Void Reduction under BGAs (optimized soldering profiles, special paste materials), Device Assembly (partial assembly to complete assembly), AOI Inspection (Automated Optical Inspection)
- Materials
- SMD Assembly, THT Assembly, Reflow Soldering, Vapor Phase Soldering, Automated Optical Inspection (AOI), X-ray Inspection
- Certificates
- ISO 9001:2015, ISO 9001
- Industries
- Rail Technology & Safety, Wind Energy, Medical Technology, Maritime Technology, Battery Management, Energy & Industry
- 01
Development of electronic solutions
- 02
International material procurement incl. obsolescence management
- 03
SMD/THT assembly
- 04
Reflow/Vapor phase soldering according to IPC standards
- 05
AOI and X-ray inspection
- 06
Assembly of assemblies/devices
- 07
Functional testing
- 08
Sales
Processes & Technologies
SMD Assembly
Automated assembly of the finest components from 01005 package size including BGA and µBGA, from prototype to mass production.
THT Assembly
Through-Hole assembly for robust, mechanically durable connections.
Reflow Soldering
Soldering according to IPC standards for reliable connections, even on high-density circuits.
Vapor Phase Soldering
Gentle soldering technology according to IPC standards for sensitive components and high solder joint quality.
Automated Optical Inspection (AOI)
Flawless quality control after assembly.
X-ray Inspection
Inspection of hidden solder joints for BGA and QFN components.
Sites
Flintbek
DEHeadquarters and Production
- Lot size
- Prototype to Mass Production
- Materials
- Printed Circuit Boards (PCB), electronic components
- Automated SMD assembly systems
- AOI inspection systems
- X-ray inspection systems
- Reflow ovens
- Vapor phase soldering systems
Assemblies
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD PCB Assembly (Surface Mounted Device)Assembly | – | – | – | Prototype – Mass Production | Printed Circuit Boards (PCB) |
| THT PCB Assembly (Through-Hole Technology)Assembly | – | – | – | – | Printed Circuit Boards (PCB) |
| BGA & µBGA AssemblyAssembly | – | – | – | – | Printed Circuit Boards (PCB) |
| Reflow Soldering (according to IPC standards)Joining | – | – | – | – | Printed Circuit Boards (PCB) |
| Vapor Phase Soldering (according to IPC standards)Joining | – | – | – | – | Printed Circuit Boards (PCB) |
| Void Reduction under BGAs (optimized soldering profiles, special paste materials)Joining | – | – | – | – | Printed Circuit Boards (PCB) |
| Device Assembly (partial assembly to complete assembly)Assembly | – | – | – | – | – |
| AOI Inspection (Automated Optical Inspection)Testing | – | – | – | – | Printed Circuit Boards (PCB) |
| X-ray Inspection (Solder Joint Inspection for BGA/QFN)Testing | – | – | – | – | Printed Circuit Boards (PCB) |
| Functional TestingTesting | – | – | – | – | – |
| Development of electronic solutions (from idea to tested assembly)Engineering | – | – | – | – | – |
| International material procurement incl. obsolescence managementEngineering | – | – | – | – | Electronic components and materials |
| Manufacturing and distribution of custom flat printed circuit boards and electronic deviceAssembly | – | – | – | – | – |
5 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMD Assembly Systems (automated) | – | – | – | – | Flintbek |
| AOI Inspection Systems | – | – | – | – | Flintbek |
| X-ray Inspection Systems | – | – | – | – | Flintbek |
| Reflow Ovens | – | – | – | – | Flintbek |
| Vapor Phase Soldering Systems | – | – | – | – | Flintbek |
Additional services
Quality & Certification
The quality management is certified according to DIN EN ISO 9001:2015 (RINA, Certificate 34869/17/AN, certified since 2005). Solder joints are inspected by AOI and X-ray inspection; soldering processes are conducted according to IPC standards, all procured materials undergo testing processes with complete traceability.
| Evidence | Flintbek |
|---|---|
| ISO 9001 |