EMS provider for electronics development, PCB design, and manufacturing of assemblies and complete devices
PRO DESIGN Electronic GmbH
BruckmühlNew on Amplifa
About us
PRO DESIGN Electronic GmbH is an EMS provider (Electronic Engineering and Manufacturing Services) based in Bruckmühl near Munich. The company develops and manufactures electronic assemblies, devices, and complete systems – from electronics development and PCB layout & CAD to series production. Manufacturing includes SMD assembly of the smallest components starting from 01005, THT assembly using selective, wave, and vapor phase soldering, mechatronics, and complete device assembly. On a production area of approx. 2,000 m², prototypes, small series, and medium volumes are manufactured according to IPC-A-610D. Additionally, test and inspection systems, error analysis, repair service, and commissioning are offered. Key markets are medical technology, image processing, Automated Test Equipment (ATE), and semiconductor testing. The company, founded in 1982, employs more than 85 staff members.
- Site
- Bruckmühl
- Processes
- SMD Assembly (Electronics), THT Assembly (automated and manual), Selective Soldering, Wave Soldering, Vapor Phase Soldering, Reflow Soldering (Vacuum Reflow Oven), Solder Paste Printing (Stencil Printing), BGA, μBGA, and FPGA Assembly and Rework
- Materials
- SMD Assembly, THT Assembly, Vacuum Reflow Soldering, Mechatronics, Test & Inspection Systems, PCB Layout & CAD
- Certificates
- DIN EN ISO 9001:2015, DIN EN ISO 14001:2015, ISO 13485:2016, ISO 9001, ISO 14001, ISO 13485
- Founded
- 1982
- Employees
- 85
- Industries
- Medical Technology, Image Processing, Automated Test Equipment (ATE)/Semiconductor Testing
- 01
Electronics Development
- 02
PCB Layout & CAD
- 03
Sourcing
- 04
SMD Assembly
- 05
THT Assembly
- 06
Mechatronics / Complete Device Assembly
- 07
Test & Inspection
- 08
Commissioning & Installation
Processes & Technologies
SMD Assembly
Assembly of the smallest components starting from 01005, as well as BGA, μBGA, and FPGA including Rework.
THT Assembly
Automated and manual through-hole mounting using selective, wave, and vapor phase soldering.
Vacuum Reflow Soldering
Vacuum reflow ovens for soldering processes with reduced voids.
Mechatronics
Assembly of modules and finished complete devices.
Test & Inspection Systems
Function testing, In-Circuit, Burn-in, and EMC testing including the development of test concepts and equipment.
PCB Layout & CAD
Multilayer designs over 60 layers, rigid, flexible, and rigid-flexible, optimized for High-Speed and EMC.
Locations
Bruckmühl
DEProduction, Development, Administration
- Lot size
- Prototypes, small series, medium volumes
- Materials
- SMD from 01005, THT
- 6 x ASMPT SIPLACE SX SMT Assembly Systems
- DEK TQL Solder Paste Printers
- DEK NeoHorizon Solder Paste Printers
- 5D-SPI System Process Lens
- 2 x Göpel 3D-AOI
- Nordson Quadra 3 X-ray Inspection (2D/3D)
- 2 x Rehm Vacuum Reflow Ovens
- Selective, wave, and vapor phase soldering systems
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD Assembly (Electronics)Assembly | – | – | – | Prototypes – medium series | – |
| THT Assembly (automated and manual)Assembly | – | – | – | – | – |
| Selective SolderingSoldering | – | – | – | – | – |
| Wave SolderingSoldering | – | – | – | – | – |
| Vapor Phase SolderingSoldering | – | – | – | – | – |
| Reflow Soldering (Vacuum Reflow Oven)Soldering | – | – | – | – | – |
| Solder Paste Printing (Stencil Printing)Assembly | Printing accuracy <20 µm | – | – | – | – |
| BGA, μBGA, and FPGA Assembly and ReworkAssembly | – | – | – | – | – |
| Assembly of the smallest components starting from 01005Assembly | – | – | – | – | – |
| Insertion Technology and GluingAssembly | – | – | – | – | – |
| Cable HarnessingAssembly | – | – | – | – | – |
| Mechatronics: Assembly of modules and complete devicesAssembly | – | – | – | – | – |
| Function Test of all modules and devicesTesting | – | – | – | – | – |
| In-Circuit TestTesting | – | – | – | – | – |
| Burn-in TestTesting | – | – | – | – | – |
| EMC TestTesting | – | – | – | – | – |
| AOI (Automated Optical Inspection)Testing | – | – | – | – | – |
| X-ray Inspection incl. BGA AnalysisTesting | – | – | – | – | – |
| SPI (Solder Paste Inspection, 5D)Testing | – | – | – | – | – |
| Test Concept and Equipment DevelopmentEngineering | – | – | – | – | – |
| Electronics Development (Concept to Market Readiness)Engineering | – | – | – | – | – |
| PCB Layout & CAD (Schematic creation, Layout data preparation)Engineering | – | – | – | – | – |
| Multilayer Designs (including >60 layers)Engineering | – | – | – | – | – |
| Rigid, flexible, and rigid-flexible PCB designsEngineering | – | – | – | – | – |
| High-Speed and High-Performance Designs (Signal Integrity, Impedance Control)Engineering | – | – | – | – | – |
| EMC-optimized LayoutsEngineering | – | – | – | – | – |
| Thermal Design & Thermal ManagementEngineering | – | – | – | – | – |
| 3D-assisted Collision Check, Mechanical Integration & Assembly ModelingEngineering | – | – | – | – | – |
| Mechanical Design & 3D DevelopmentEngineering | – | – | – | – | – |
| Commissioning & InstallationAssembly | – | – | – | – | – |
| Redesign & Further DevelopmentEngineering | – | – | – | – | – |
| Error Analysis and Repair ServiceTesting | – | – | – | – | – |
8 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMT Assembly Systems (High-Speed, modular) | ASMPT SIPLACE SX | 6 | – | – | Bruckmühl |
| Solder Paste Printers (Solder Paste Printing, Closed-Loop SPI) | DEK TQL | – | – | – | Bruckmühl |
| Solder Paste Printers (fully automatic) | DEK NeoHorizon | – | – | – | Bruckmühl |
| 5D-SPI System (Solder Paste Inspection) | Process Lens | – | – | – | Bruckmühl |
| 3D-AOI System | Göpel | 2 | – | – | Bruckmühl |
| X-ray Inspection System (2D/3D) | Nordson Quadra 3 | – | – | – | Bruckmühl |
| Vacuum Reflow Oven | Rehm Thermal Systems | 2 | – | 2018 | Bruckmühl |
| Assembly Machines | ASM Assembly Systems | 3 | – | 2018 | Bruckmühl |
Additional services
Quality
Manufacturing is carried out according to IPC-A-610D with multiple quality checks during the process, optical inspection at five stations, AOI, 5D-SPI, X-ray inspection including BGA analysis, as well as documentation and traceability. Certifications: DIN EN ISO 9001:2015, DIN EN ISO 14001:2015, and DIN EN ISO 13485:2016.
| Evidence | Bruckmühl |
|---|---|
| ISO 9001 | |
| ISO 14001 | |
| ISO 13485 |
History
- 1982
Founded as Helmut Mahr GmbH, later PRO DESIGN Electronic GmbH
- 2002
Participation in the Bavaria Environmental Pact
- 2018
Investment in new production hall and SMD machines: solder paste printers, three ASM assembly machines, two Rehm vacuum reflow ovens
- 2025
Replacement of the Europlacer line with a second SIPLACE line, now two identical systems