Manufacturing of electronic assemblies: SMT and THT placement from prototypes to high-volume production, ISO 9001 certified.
TECDESIGN Elektronik GmbH
Ellerau (Schleswig-Holstein), Hamburg Metropolitan Region · Plant 1 & Plant 2, approx. 1,250 m²New on Amplifa
About Us
TECDESIGN Elektronik GmbH is an owner-managed EMS provider (Electronic Manufacturing Services) based in Ellerau on the outskirts of Hamburg. The family business, founded in 1987, assembles electronic boards in SMT and THT technology – from prototypes and small series through to high-volume production – according to international IPC standards (including J-STD-001 and IPC-A-610), RoHS-compliant in lead-free technology. The Smart SMT Factory with two SIPLACE production lines from ASMPT places up to 117,900 components per operating hour on board sizes up to 600 x 460 mm and component sizes from 01005 to 45 x 87.5 mm. The portfolio includes reflow, vapor-phase and selective soldering under nitrogen, 3D AOI inspection, 2D X-ray spectroscopy, functional testing, climate testing, software programming, Design for Manufacturing as well as obsolescence management. Customers include measurement and data technology, automotive, telecommunications, aerospace, recycling, industrial electronics, medical technology, traffic control systems and shipbuilding. The quality management system has been certified to DIN EN ISO 9001 by TÜV Süd since 2005.
- Site
- Ellerau
- Processes
- SMT placement of PCBs (Smart SMT Factory), THT placement, Reflow soldering, Vapor-phase soldering, Automatic selective soldering under nitrogen atmosphere, Automated stencil printing with 2D inspection (solder paste, adhesive), Dispensing technology, Rework and prototyping of assemblies
- Materials
- SMT placement, THT placement, Reflow soldering, Vapor-phase soldering, Selective soldering under nitrogen, Dispensing technology, 3D AOI inspection to IPC-A-610, 2D X-ray spectroscopy
- Certificates
- DIN EN ISO 9001:2015, EcoVadis Gold, Green electricity certificate (100% renewable energy, 2025-2026), TÜV certificate biogas (min. 15% biomethane, 01.10.2025-30.09.2026), CO2-neutral website, ISO 9001, IPC J-STD-001 / IPC-A-610, RoHS-compliant manufacturing, ESD/MSL (DIN EN 61340)
- Founded
- 1987
- Industries
- Measurement and data technology, Automotive, Telecommunications, Aerospace, Recycling, Industrial electronics
- 01
Incoming goods with scan traceability (MODI Vision)
- 02
Material procurement & obsolescence management
- 03
Stencil printing with 2D inspection
- 04
SMT/THT placement (SIPLACE/JUKI)
- 05
Reflow, vapor-phase & selective soldering
- 06
AOI / X-Ray / functional test
- 07
Rework & prototyping
- 08
Assembly, packaging, dispatch
Processes & Manufacturing Technology
SMT placement
Surface-Mount Technology from 01005 to 45 x 87.5 mm component size with 30 µm placement accuracy (3σ).
THT placement
Through-hole placement, also possible for significantly larger components than in the SMT range.
Reflow soldering
Convection soldering with the Ersa HOTFLOW 2/12 for reproducible solder joints.
Vapor-phase soldering
Batch vapor-phase soldering with Rehm Condenso and ASSCON systems for thermally gentle processes.
Selective soldering under nitrogen
Automatic selective soldering with the Kurtz Ersa system for consistently high-quality solder joints.
Dispensing technology
Automated adhesive and paste application including 2D inspection.
3D AOI inspection to IPC-A-610
True-3D measurement with Koh Young Zenith Alpha HS+ (AI-supported, height measuring range up to 25 mm).
2D X-ray spectroscopy
Non-destructive inspection of non-visible solder joints, e.g. under BGAs, at first release.
Electrical functional test
Circuit-appropriate, customer-specific functional test including documented calibration.
Design for Manufacturing
Manufacturing optimization of the PCB including panelization for more efficient production.
Locations
Ellerau (Plant 1 & Plant 2)
DECompany headquarters, SMT/THT production and testing
- Part weight / size
- Boards up to 600 x 460 mm, components 01005 to 45 x
- Lot size
- Prototypes, small, medium and high-volume series
- Materials
- Assembly manufacturing to IPC J-STD-001 / IPC-A-610, RoHS-compliant
- 2 SIPLACE production lines (ASMPT): High-Mix-Low-Volume and fully automatic High-Volume
- Kurtz Ersa selective soldering system
- Ersa HOTFLOW 2/12 convection soldering system
- Rehm Condenso vapor-phase soldering system
- ASSCON VP56-1000 and Quicky 300 vapor-phase soldering systems
- DEK Horizon 03i / 01i stencil printers
- JUKI FX-3, KE-2070L, KE-2080L, KE-3020L placement machines
- Koh Young Zenith Alpha HS+ 3D AOI
- Schneider & Koch LaserVision Compact II/III AOI
- ZEVAC 2D X-ray device
- ERSASCOPE 2 PLUS
- Memmert universal heating oven (climate test)
- Mantis inspection system
- MODI Vision incoming goods scanner
Assemblies & Industries
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMT placement of PCBs (Smart SMT Factory)Assembly | Placement accuracy 30 µm (3σ) | 600 mm (board size) × 460 mm | – | Prototypes – High-volume series | Electronic components (01005 to 45 x 87.5 mm) |
| THT placementAssembly | – | – | – | – | – |
| Reflow solderingJoining | – | – | – | – | – |
| Vapor-phase solderingJoining | – | – | – | – | – |
| Automatic selective soldering under nitrogen atmosphereJoining | – | – | – | – | – |
| Automated stencil printing with 2D inspection (solder paste, adhesive)Assembly | – | – | – | – | – |
| Dispensing technologyAssembly | – | – | – | – | – |
| Rework and prototyping of assembliesAssembly | – | – | – | – | – |
| Electrical functional test (circuit-appropriate, customer-specific)Testing | – | – | – | – | – |
| 3D AOI inspection to IPC-A-610Testing | – | 25 mm (height measuring range) | – | – | – |
| 2D X-ray spectroscopy (X-Ray, non-destructive inspection of non-visible solder joints)Testing | – | – | – | – | – |
| Climate and climate change testTesting | – | – | – | – | – |
| Software programming (PIC, GAL, PAL, FLASH, EPROM, EEPROM, ROM)Engineering | – | – | – | – | – |
| Design for Manufacturing / manufacturing optimization including panelizationEngineering | – | – | – | – | – |
| Obsolescence managementEngineering | – | – | – | – | – |
| Baking and long-term storage of electronic componentsHeat treatment | – | – | – | – | – |
| Manual cleaning of assembliesSurface | – | – | – | – | – |
| Device assembly / complete material logisticsAssembly | – | – | – | – | – |
21 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMT placement line (High-Mix-Low-Volume) | ASMPT (ASM Assembly Systems/Siemens) SIPLACE | 1 | – | – | Ellerau |
| SMT placement line (fully automatic, High-Volume) | ASMPT (ASM Assembly Systems/Siemens) SIPLACE | 1 | – | – | Ellerau |
| Selective soldering system | Kurtz Ersa | 1 | – | – | Ellerau |
| 3D AOI measurement system (True-3D) | Koh Young Technology Zenith Alpha HS+ | 1 | Height measuring range up to 25 mm | – | Ellerau |
| Reflow convection soldering system | Ersa HOTFLOW 2/12 | 1 | – | 2012 | Ellerau |
| Vapor-phase soldering system (batch) | Rehm Condenso | 1 | – | 2007 | Ellerau |
| Vapor-phase soldering system | ASSCON Quicky 300 | 1 | – | 1999 | Ellerau |
| Vapor-phase soldering system | ASSCON VP56-1000 | 1 | – | 2004 | Ellerau |
| 2D X-ray device | ZEVAC | 1 | – | 2004 | Ellerau |
| Fully automatic stencil printer | DEK Horizon 03i | 1 | – | 2006 | Ellerau |
| Stencil printer (prototype line) | DEK Horizon 01i | 1 | – | 2012 | Ellerau |
| Chip Shooter SMT placement machine | JUKI FX-3 | 1 | – | 2008 | Ellerau |
| SMT placement machine | JUKI KE-3020L | 1 | – | 2010 | Ellerau |
| SMT placement machine | JUKI KE-2080L | 1 | – | 2011 | Ellerau |
| SMT placement machine | JUKI KE-2070L | 1 | – | 2008 | Ellerau |
| SMT placement machine | JUKI FX-1R | – | – | 2006 | Ellerau |
| Optical PCB inspection system (AOI) | Schneider & Koch Prüftechnik LaserVision Compact II / III | 1 | – | 2006/2008 | Ellerau |
| Inspection system (drill hole inspection) | ERSA ERSASCOPE 2 PLUS | 1 | – | 2007 | Ellerau |
| Universal heating oven (climate test) | Memmert | 1 | – | – | Ellerau |
| Manual visual inspection (PCB inspection system) | Mantis | – | – | – | Ellerau |
| Incoming goods scanner | MODI Vision | 1 | – | – | Ellerau |
Additional services
Quality Management
Assemblies undergo numerous in-process inspections during production, including 100% 3D AOI inspection to IPC-A-610 as well as 2D X-ray spectroscopy, functional test and climate test. The quality management system has been certified to DIN EN ISO 9001 (since 2017 to the 9001:2015 standard) by TÜV Süd since 2005 and is complemented by annual surveillance audits, an in-house TÜV-certified QMB and seamless material and process traceability.
| Evidence | Ellerau |
|---|---|
| ISO 9001 | |
| IPC J-STD-001 / IPC-A-610 | |
| RoHS-compliant manufacturing | |
| ESD/MSL (DIN EN 61340) |
Company History
- 1987
Founding of TECDESIGN on 01.10.1987 by Jörg Struwe; production of assemblies in THT placement technology.
- 1991
First steps in SMT placement technology.
- 1993
Purchase of the first fully automatic SMT placement machine.
- 1994
Second SMT placement machine for parallel production.
- 1998
Third stand-alone SMT placement machine.
- 1999
Vapor-phase soldering with the ASSCON Quicky 300 in prototype production.
- 2000
Founding of TECDESIGN Elektronik GmbH; first SMT production line with JUKI FS 710/720.
- 2002
Planning of a new building with doubling of the production area.
- 2003
Completion of the production building in Ellerau, relocation in May.
- 2004
JUKI KE-760L, ASSCON VP56-1000 vapor-phase soldering system and ZEVAC X-ray device.
- 2005
Initial certification to DIN EN ISO 9001:2000 in February; JUKI KE-2060L.
- 2006
New JUKI compact line (DEK Horizon 03i, FX-1R, KE-2060L); AOI Schneider & Koch LaserVision Compact II.
- 2007
ERSASCOPE 2 PLUS, Rehm Condenso vapor-phase soldering system; expansion of the production area.
- 2008
JUKI KE-2070L and FX-3; approx. 350 sqm more floor space; 22 million components/month in single-shift operation; over one million assemblies produced.
- 2010
JUKI KE-3020L replaces the KE-760L.
- 2011
JUKI KE-2080L replaces FX-1R and KE-2060L.
- 2012
Full automation of the high-speed line; DEK Horizon 01i for the prototype line; Ersa HOTFLOW 2/12.
- 2017
Conversion of the QM certificate to ISO 9001:2015.
- 2022
EcoVadis Gold medal for sustainability for the first time.
- 2025
Switch to 100% green electricity and 15% biogas.