Manufacture of connectors and cable assemblies for electronics and data processing technology
W+P PRODUCTS GmbH
32257 BündeNew on Amplifa
About W+P PRODUCTS
W+P PRODUCTS GmbH, based in Bünde, has been active in the world of electromechanical components for over 30 years and manufactures connector solutions for all application areas related to the printed circuit board. The portfolio comprises pin headers and female headers, D-Sub connectors, IC, PLCC and PGA sockets, push buttons and switches, flat ribbon cable connections, modular and RJ connectors, card edge connectors, wire-to-board and board-to-board connectors, ZIF/LIF connectors, multimedia, LED and power connectors, terminal blocks, waterproof and circular connectors, as well as wires and cable assemblies. In addition to an extensive standard portfolio with more than 20,000 products and product variants from its own production, the company's strength lies in the development of customized bespoke manufacturing. Automated production takes place in Germany and China. The insulating bodies are made of plastic, contacts of metal or copper alloys; processes such as crimping, IDC, press-fit, WireWrap, SMT assembly as well as THT/THR, reflow and wave soldering technology are used.
- Site
- Bünde
- Processes
- Manufacture of connectors (pin headers, female headers, D-Sub, IC sockets, push buttons/switches,, Cable assemblies (wires & cable assemblies, USB cable assemblies, network cables), Crimping (D-Sub connectors, crimp mounting), IDC processing (Insulation Displacement Contact), Press-fit mounting, SMT assembly (surface mount technology, intended for component design), THT/THR soldering technology (through-hole/through-hole reflow), Wave soldering (soldering profile recommendation, solder bath temperature 260°C, max. 5 seconds)
- Materials
- Plastic (insulating bodies), Copper (contacts, conductors), SMT assembly, THT/THR soldering technology, Wave soldering, IDC processing, Crimping, Press-fit mounting
- Certificates
- DIN EN ISO 9001:2015, DIN EN ISO 14001:2015, ISO 9001, ISO 14001
- Industries
- Electronics, Data processing technology
- 01
Development and engineering of connector solutions
- 02
Plastic injection molding for insulating bodies
- 03
Automated production of connectors (Germany and China)
- 04
Cable assembly and mounting (crimping, IDC, press-fit, WireWrap)
- 05
Sales via sales partners and distributors
Materials & Processes
Plastic (insulating bodies)
Injection-molded insulating bodies, e.g. 1.5 mm and 1.7 mm formats for pin headers.
Copper (contacts, conductors)
Contacts and copper conductors (including AWG 24/26/28) for connectors and cable assemblies.
SMT assembly
Surface-mount technology as a mounting and processing method for numerous connector series.
THT/THR soldering technology
Through-hole and through-hole reflow mounting, including soldering profile recommendations according to IPC/JEDEC J-STD-020C.
Wave soldering
Processing with solder bath temperature of 260 °C and max. 5 seconds dwell time.
IDC processing
Insulation Displacement Contact for flat ribbon cable connections and IC socket connectors.
Crimping
Crimp mounting, among others for D-Sub connectors.
Press-fit mounting
Solder-free mounting of connector contacts in printed circuit boards.
WireWrap mounting
Mounting method for D-Sub connectors.
Locations
Bünde
DEHeadquarters, development, production, sales
- Materials
- Plastic, copper alloys
Components & Products
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Manufacture of connectors (pin headers, female headers, D-Sub, IC sockets, push buttons/switches,Assembly | – | – | – | – | Plastic (insulating bodies), Metal (contacts), Copper alloys (contacts, not further specified) |
| Cable assemblies (wires & cable assemblies, USB cable assemblies, network cables)Assembly | – | – | – | – | AWG 24, AWG 26, AWG 28, Copper |
| Crimping (D-Sub connectors, crimp mounting)Assembly | – | – | – | – | – |
| IDC processing (Insulation Displacement Contact)Assembly | – | – | – | – | – |
| Press-fit mountingAssembly | – | – | – | – | – |
| SMT assembly (surface mount technology, intended for component design)Assembly | – | – | – | – | – |
| THT/THR soldering technology (through-hole/through-hole reflow)Joining | – | – | – | – | – |
| Wave soldering (soldering profile recommendation, solder bath temperature 260°C, max. 5 seconds)Joining | – | – | – | – | – |
| Reflow soldering (short reflow soldering process per IPC/JEDEC J-STD-020C, lead-free, TP 260°C max.)Joining | – | – | – | – | – |
| WireWrap mountingAssembly | – | – | – | – | – |
| Automated production of customer-specific connectors (custom manufacturing)Assembly | – | – | – | – | – |
| Development and engineering of connector solutionsEngineering | – | – | – | – | – |
| Plastic injection molding for insulating bodies (1.5mm/1.7mm insulating bodies, plastic hoods)Plastics | – | – | – | – | Plastic |
Additional services
Reference customers
Quality & Certification
As a DIN EN ISO certified company, W+P PRODUCTS safeguards the quality of development, production and sales through a certified quality and environmental management system (ISO 9001:2015 and ISO 14001:2015).
| Evidence | Bünde |
|---|---|
| ISO 9001 | |
| ISO 14001 |
History
Over 30 years of activity in the world of electromechanical components
Merger of the companies W+P PRODUCTS GmbH and W+P Electronic GmbH